Electric field driven micro 3D printing of high-precision circuit on bismaleimide resin matrix composite

Fiber-modified bismaleimide resin matrix composites are widely used in aerospace, smart skins, conformal antennas, electromagnetic shielding, high-frequency circuit substrates, and electrical heating by virtue of their excellent mechanical properties, high-temperature and corrosion-resistant characteristics. However, due to the non-flat, heterogeneous, and anisotropic characteristics of bismaleimide resin matrix composites, the simple, efficient, and low-cost fabrication of high-resolution circuits on this substrate is a current challenge to be solved. In this paper, a new method for fabricating high-precision circuits based on electric-field-driven micro-3D printing on quartz fiber modified bismaleimide resin matrix composites are proposed, and the basic forming principle and key technology implementation are described. Explored the characteristics of electric field distribution on the surface of non-flat heterogeneous composites and the changing law of field strength, and proposed a strategy to realize stable printing adjusting the threshold of electric field strength. The effects of the main process parameters on the precision, morphology and performance of the fabricated circuits were revealed experimentally, and the fabrication of various patterned circuits with a minimum line width of 50 μm had been realized by combining with an optimized process parameter. The typical sample manufactured had a conductivity of 4.5×10⁷ S/m, and the resistance change rate was around 1% after 100 times of adhesion testing and 100 min ultrasonic experiments. It had excellent thermal response speed when applied to electric heating applications, and the maximum temperature can reach 158℃ under 3 V, and de-icing can be realized within 200 s. This technology provides an effective method for the efficient and low-cost fabrication of fiber modified bismaleimide resin composite-based circuits, showing good prospects for industrial applications.