Preparation and properties of hexagonal boron nitride/semi-aromatic polyamide 12T composites with high-temperature resistance and high thermal conductivity prepared by mixed solvent dispersion method

CHEN Xiaojie; MA Ge; MENG Huidi; CUI Zhe; FU Peng; ZHAO Wei; PANG Xinchang; ZHAO Qingxiang; LIU Minying; ZHANG Xiaomeng

doi:10.13801/j.cnki.fhclxb.20220321.003

Volume 40 Issue 2

Feb. 2023

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CHEN Xiaojie, MA Ge, MENG Huidi, et al. Preparation and properties of hexagonal boron nitride/semi-aromatic polyamide 12T composites with high-temperature resistance and high thermal conductivity prepared by mixed solvent dispersion method[J]. Acta Materiae Compositae Sinica, 2023, 40(2): 825-835. doi: 10.13801/j.cnki.fhclxb.20220321.003

Citation:

CHEN Xiaojie, MA Ge, MENG Huidi, et al. Preparation and properties of hexagonal boron nitride/semi-aromatic polyamide 12T composites with high-temperature resistance and high thermal conductivity prepared by mixed solvent dispersion method[J]. Acta Materiae Compositae Sinica, 2023, 40(2): 825-835. doi: 10.13801/j.cnki.fhclxb.20220321.003

Citation:

CHEN Xiaojie, MA Ge, MENG Huidi, et al. Preparation and properties of hexagonal boron nitride/semi-aromatic polyamide 12T composites with high-temperature resistance and high thermal conductivity prepared by mixed solvent dispersion method[J]. Acta Materiae Compositae Sinica, 2023, 40(2): 825-835. doi: 10.13801/j.cnki.fhclxb.20220321.003

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Preparation and properties of hexagonal boron nitride/semi-aromatic polyamide 12T composites with high-temperature resistance and high thermal conductivity prepared by mixed solvent dispersion method

doi: 10.13801/j.cnki.fhclxb.20220321.003

1.
Henan Key Laboratory of Advanced Nylon Materials and Application, Engineering Laboratory of High-Performance Nylon Engineering Plastics of China Petroleum and Chemical Industry, School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001, China
2.
State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
3.
Jinguan Electric CO., LTD., Nanyang 473000, China

Funds: National Key Research and Development Program of China (2017YFB0307600); China Postdoctoral Science Foundation (2020M682317); Henan Postdoctoral Foundation (202002018); Opening Project of State Key Laboratory of Polymer Materials Engineering (sklpme2021-05-10); Key Scientific Research Projects of Colleges and Universities in Henan Province (22A430037)

Received Date: 2022-01-10
Accepted Date: 2022-03-13
Rev Recd Date: 2022-03-04

Available Online: 2022-03-22

Publish Date: 2023-02-15

Abstract

Abstract

Fabrication of the polymer-based composites with excellent high temperature resistance and thermal conductivity is very important for the packaging protection, efficient heat dissipation and processing of electronic components. In this work, high temperature resistant and thermally conductive hexagonal boron nitride (BN)/semi-aromatic polyamide 12T (PA12T) composites with uniform dispersion and orientation filler structure were prepared by mixed solvent dispersion (MSD) method, and the microstructure, thermal conductivity, high-temperature resistance, dielectric and mechanical properties of the composites were systematically characterized. The results show that the BN powder and PA12T powder can be suspended uniformly in the mixed solvent. Next, combining the vacuum-assisted self-assembly technique and vacuum hot compression method, the composites with uniformly dispersed and oriented BN structure are fabricated successfully. When the content of BN is 40wt% in BN/PA12T composite, the in-plane thermal conductivity of the composite prepared by the MSD method is 2.73 W/(m·K), which is 1.72 times that of the composite (1.59 W/(m·K)) prepared by the mechanical mixing (MM) method. Furthermore, the composite prepared by the MSD method also possesses excellent mechanical properties, low dielectric permittivity of 3.6 and dielectric loss of 0.016, outstanding high-temperature resistance with the initial decomposition temperature of 446℃ and Vicat softening temperature of more than 250℃. Therefore, the BN/PA12T composite prepared by the MSD method will have a wide range of applications in the fields of electronic packaging and thermal management.
- polyamide,
- mixed solvent dispersion method,
- high-temperature resistance,
- thermally conductive composite,
- hexagonal boron nitride
Long Abstrsct
Innovation Points

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References(48)

References

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