Lin Shuo, Wu Nian-qiang, Li Zhi-zhang. EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS[J]. Acta Materiae Compositae Sinica, 1999, 16(4): 44-49.
Citation:
|
Lin Shuo, Wu Nian-qiang, Li Zhi-zhang. EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS[J]. Acta Materiae Compositae Sinica, 1999, 16(4): 44-49.
|
Lin Shuo, Wu Nian-qiang, Li Zhi-zhang. EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS[J]. Acta Materiae Compositae Sinica, 1999, 16(4): 44-49.
Citation:
|
Lin Shuo, Wu Nian-qiang, Li Zhi-zhang. EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS[J]. Acta Materiae Compositae Sinica, 1999, 16(4): 44-49.
|
EFFECT OF COUPLING AGENT ON ELECTRIC CONDUCTIVITY STABILITY OF COPPER FILLED COMPOSITE PAINTS
- 1.
Department of Mechanical Engineering, Zhejiang University, Hangzhou 310027;
- 2.
Department of Materials Science and Engineering, Zhejiang University, Hangzhou 310027
- Received Date: 1998-03-21
- Rev Recd Date:
1998-08-17
- Publish Date:
1999-12-25