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Wang Yu-lin, Wan Yi-zao, Cheng Guo-xiang, et al. EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES[J]. Acta Materiae Compositae Sinica, 1998, 15(1): 83-87.
Citation: Wang Yu-lin, Wan Yi-zao, Cheng Guo-xiang, et al. EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES[J]. Acta Materiae Compositae Sinica, 1998, 15(1): 83-87.
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EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES

  • Dept. of Materials Science and Engineering, Tianjin University, Tianjin 300072

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  • Received Date: July 02, 1996
  • Revised Date: November 11, 1996
    Abstract
  • C/Cu composites with different interface bonding strength have been fabricated by adding Sn,Ni or Fe element to the copper matrix. The effect of interface bonding strength on the thermal expansion behavior of C/Cu composites has been investigated. Its influence on the contracting behavior (occurring at the cooling stage) and the residual strain values of composites has also been studied in this paper.
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