EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES

C/Cu composites with different interface bonding strength have been fabricated by adding Sn,Ni or Fe element to the copper matrix. The effect of interface bonding strength on the thermal expansion behavior of C/Cu composites has been investigated. Its influence on the contracting behavior (occurring at the cooling stage) and the residual strain values of composites has also been studied in this paper.