DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST

The bending problem of thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films, temperature and deformation of specimen surfaces is derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test.