DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST

SHEN Wei; PENG Li-hua; LI Wei; Tang C Y

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Article Navigation > Acta Materiae Compositae Sinica > 2001 > 18(2): 90-93

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

Citation:

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

Citation:

SHEN Wei, PENG Li-hua, LI Wei, et al. DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST[J]. Acta Materiae Compositae Sinica, 2001, 18(2): 90-93.

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DETERMINING THERMAL EXPANSION COEFFICIENT OF CONDUCTIVE THIN FILM BY THERMAL BEND TEST

1.
Department of Mechanics, Huazhong University of Science and Technology, 430074,China;
2.
Structure Mechanics Research Group, Wuhan University of Hydraulic and Electric Engineering, 430072,China;
3.
Department of Manufacturing Engineering, The Hong Kong Polytechnic University,Hong Kong, China

Received Date: 2000-01-19
Rev Recd Date: 2000-05-15
Publish Date: 2001-05-15

Abstract

Abstract

The bending problem of thin film/substrate composite subjected to thermal load is studied. The relation between the thermal expansion coefficient of conductive thin films, temperature and deformation of specimen surfaces is derived in this paper. Based on the findings, a method for measuring the thermal expansion coefficient of conductive thin films is developed. The thermal expansion coefficient of conductive thin films has been measured by applying the method in a thermal bend test.
- conductive thin film,
- thermal expansion coefficient,
- electro-thermal effect,
- thermal bend test
Long Abstrsct
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