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WANG Rong-guo, TIAN Qiu, MA Wen-you, et al. MODULATING VOID ACTION AND RESIDUAL STRESS VARIATION OF COMPOSITE MATERIALS DURING CURING PROCESS[J]. Acta Materiae Compositae Sinica, 2002, 19(5): 95-101.
Citation: WANG Rong-guo, TIAN Qiu, MA Wen-you, et al. MODULATING VOID ACTION AND RESIDUAL STRESS VARIATION OF COMPOSITE MATERIALS DURING CURING PROCESS[J]. Acta Materiae Compositae Sinica, 2002, 19(5): 95-101.
shu

MODULATING VOID ACTION AND RESIDUAL STRESS VARIATION OF COMPOSITE MATERIALS DURING CURING PROCESS

  • 1.

    Material Science and Engineering Academy, Harbin Institute of Technology, Harbin 150006,China;

  • 2.

    Material Science and Engineering Department,Harbin Engineering University, Harbin 150001,China;

  • 3.

    Hei Longjiang Information Center, Harbin 150030, China;

  • 4.

    Heihe Entry &|Exit Inspection &|Quarantine Bureau, Heihe 164300, China

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  • Received Date: January 15, 2001
  • Revised Date: April 07, 2002
    Abstract
  • It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites.Void action and residual stress act as the main actors of influencing the quality of composite products.In this paper, the principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the formation of the void and residual stress. The results of computation can be the base for the design of the operation process of the composite curing process.
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