ZHU Yao-min, XIE Jing-pei, LI Xiao-hui, et al. INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiCP／ZA27 COMPOSITE[J]. Acta Materiae Compositae Sinica, 2002, 19(4): 42-45.
Citation:
ZHU Yao-min, XIE Jing-pei, LI Xiao-hui, et al. INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiCP／ZA27 COMPOSITE[J]. Acta Materiae Compositae Sinica, 2002, 19(4): 42-45.
ZHU Yao-min, XIE Jing-pei, LI Xiao-hui, et al. INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiCP／ZA27 COMPOSITE[J]. Acta Materiae Compositae Sinica, 2002, 19(4): 42-45.
Citation:
ZHU Yao-min, XIE Jing-pei, LI Xiao-hui, et al. INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiCP／ZA27 COMPOSITE[J]. Acta Materiae Compositae Sinica, 2002, 19(4): 42-45.
INTERFACE STRUCTURES AND HIGH TEMPERATURE CREEP PROPERTY OF SiCP／ZA27 COMPOSITE
Interface structure and high temperature creep property of the SiC/ZA27 composite have been investigated by means of TEM and HREM. The results show that there are an amorphous layer of 20nm thick and polygonal shaped precipitates on the interface between SiC particles and the ZA27 matrix. SiC particles could enhance the high temperature property of the composite remarkably.
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