PREPARATION OF THE COPPER CLAD LAMINATE BASED ON MODIFIED EPOXY WITH POLY (2,6-DIMETHYL-1,4-PHENYLENE ETHER)

Bromize epoxy (BEP), which is always used as the resin matrix of copper clad laminate (CCL), has faced the challenge to prepare the high performance CCL for the deficiencies such as not-enough thermal resistance, poorer dielectric properties at higher frequencies, inferior size stability at higher temperatures and lower toughness and so on. The authors prepared high-performance CCL by introducing poly (2,6-dimethyl-1, 4-phenylene ether)(PPO or PPE) as the modification resin to solve the problem mentioned above. For solutions of PPO and BEP, the upper critical solution temperature (UCST) cloud point curves intersect the glass transition-composition lines at a PPO content of 60 wt%~70 wt%. Cure behavior and miscibility have been studied in blends of PPO with BEP and dicyandiamide (DICY) hardener, EMI-2, 4imidazole as accelerator by gel tests and FTIR. The reasonable process of half-curing are settled down by considering the influence of the process on the properties of the half-cured sheet and CCL. The results show that PPO/BEP form a uniform system or glue with some certain solvents; the properties of the CCL prepared using the PPO/BEP are much better than those of the conventional CCL (FR-4), especially the dielectric properties, thermal stability, flexural strength and water resistance.