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LI Aixia, SUN Daming, SUN Zhaoqi, et al. EFFECT OF SUBSTRATE TEMPERATURE ON RESIDUAL STRESS IN Ag-MgF2 CERMET FILMS[J]. Acta Materiae Compositae Sinica, 2004, 21(2): 22-26.
Citation: LI Aixia, SUN Daming, SUN Zhaoqi, et al. EFFECT OF SUBSTRATE TEMPERATURE ON RESIDUAL STRESS IN Ag-MgF2 CERMET FILMS[J]. Acta Materiae Compositae Sinica, 2004, 21(2): 22-26.
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EFFECT OF SUBSTRATE TEMPERATURE ON RESIDUAL STRESS IN Ag-MgF2 CERMET FILMS

  • Department of Physics, Anhui University, Hefei 230039,China

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  • Received Date: December 19, 2002
  • Revised Date: April 02, 2003
    Abstract
  • This paper has investigated the effect of substrate temperature on the residual stress and microstructure of Ag-MgF2 cermet films prepared by vapor deposition. X-ray diffraction (XRD) technique was employed to study the microstructure of the films. The results show that the average stress over a φ20.4 mm round area is the least and the residual stress of the films appears to be tensile stress between 300℃ and 400℃. Crystal lattice constants of Ag and MgF2 both approach the bulk values. The residual stress of the films can be decreased by altering the substrate temperature.
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