QIU Jingjing, DUAN Yuexin, LIANG Zhiyong. COMPUTER SIMULATION AND ACTUAL EXPERIMENTS OF RTM MOLD-FILLING PROCESS AFFECTED BY PROCESSING PARAMETERS[J]. Acta Materiae Compositae Sinica, 2004, 21(6): 70-74.
Citation:
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QIU Jingjing, DUAN Yuexin, LIANG Zhiyong. COMPUTER SIMULATION AND ACTUAL EXPERIMENTS OF RTM MOLD-FILLING PROCESS AFFECTED BY PROCESSING PARAMETERS[J]. Acta Materiae Compositae Sinica, 2004, 21(6): 70-74.
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QIU Jingjing, DUAN Yuexin, LIANG Zhiyong. COMPUTER SIMULATION AND ACTUAL EXPERIMENTS OF RTM MOLD-FILLING PROCESS AFFECTED BY PROCESSING PARAMETERS[J]. Acta Materiae Compositae Sinica, 2004, 21(6): 70-74.
Citation:
|
QIU Jingjing, DUAN Yuexin, LIANG Zhiyong. COMPUTER SIMULATION AND ACTUAL EXPERIMENTS OF RTM MOLD-FILLING PROCESS AFFECTED BY PROCESSING PARAMETERS[J]. Acta Materiae Compositae Sinica, 2004, 21(6): 70-74.
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COMPUTER SIMULATION AND ACTUAL EXPERIMENTS OF RTM MOLD-FILLING PROCESS AFFECTED BY PROCESSING PARAMETERS
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School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
- Received Date: 2003-11-11
- Rev Recd Date:
2004-01-05
- Publish Date:
2004-12-15