ZHOU Wenying, QI Shuhua, WANG Caifeng, et al. High temperature and insulating heat conductive coating[J]. Acta Materiae Compositae Sinica, 2007, 24(2): 28-32.
Citation: ZHOU Wenying, QI Shuhua, WANG Caifeng, et al. High temperature and insulating heat conductive coating[J]. Acta Materiae Compositae Sinica, 2007, 24(2): 28-32.

High temperature and insulating heat conductive coating

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  • Corresponding author:

    QI Shuhua

  • Received Date: May 16, 2006
  • Revised Date: July 16, 2006
  • The thermal conductive coating was obtained with the epoxy modified silicone resin as matrix, and the mixture of silicone nitride and alumina as the heat conductive fillers. Its mechanical properties, thermal conductivity, electrical insulation and thermal stability were studied. The results indicate that at the total 40% mass fraction of fillers and preferable mass ratio of alumina to silicone nitride, the tensile strength, elongation at break and adhesion of the coating are 8.02MPa, 1.27% and 572.2N · cm-2, respectively; and its thermal conductivity, dielectric constant, volume resistivity and surface resistivity are 1.25 W · (m · K)-1, 5.7, 3×1013Ω · cm and 4.3×1013Ω, respectively. In addition, the coating can be used for a long term at about 200℃. The results also demonstrate that the coating has higher heat conduction compared with the unfilled epoxy modified silicone resin based coating.
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