Numerical simulation of soft-mode aided co-curing process for advanced grid stiffen structure[J]. Acta Materiae Compositae Sinica, 2010, 27(1): 25-31.
Citation: Numerical simulation of soft-mode aided co-curing process for advanced grid stiffen structure[J]. Acta Materiae Compositae Sinica, 2010, 27(1): 25-31.

Numerical simulation of soft-mode aided co-curing process for advanced grid stiffen structure

  • Received Date: 2009-02-13
  • Rev Recd Date: 2009-06-01
  • Publish Date: 2010-02-15
  • Based on the 2D plane strain finite element analysis model and strategy  the influences of technology gap, curing cycle and residual stress on the performance of grid structure were studied. From numerical simulation of the co-curing process for a typical advanced grid stiffen structure, a method for appropriate technical gap is given, the strategy for reducing the gradient of coupling fields is provided and the mechanism of residual stress generation is explained. Therefore, this study will be meaningful for the proper determination of technical parameters during soft-mode aided co-curing processes.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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