Chemo-rheological model of low temperature curing bisphenol-F epoxy resin system
-
Abstract
The chemo-rheological behavior of low temperature curing bisphenol- F epoxy resin for vacuum assisted resin transfer molding was studied by means of viscosity experiments. An engineering viscosity model was established and used to simulate the rheological behavior of the epoxy resin system. The estimated viscosity values of the established model are in good agreement with the experimental ones. The glass transition temperature,tensile strength and bending strength of the epoxy resin reach 111.9℃,78.5 MPa and 106 MPa,respectively. The engineering model can be used to predict the processing windows of different processing parameters of VARTM process,which is critical for the simulation and optimization of composite manufacturing processes.
-
-