Advances in interfacial modulation and thermal conductivity of diamond/Al composite heat dissipation materials

Diamond /Al composites have the advantages of low density, high thermal conductivity and adjustable thermal expansion coefficient, and thus become one of the research hotspots of thermal management materials in recent years. However, Al₄C₃, the interface product between diamond and Al, will seriously affect the properties of the composites, increase the thermal resistance at the diamond-Al interface, and its easy hydrolysis will easily lead to the failure of the composites in service. In this paper, starting with the negative effects of interface Al₄C₃ phase, the effects of the current main methods to inhibit interfacial Al₄C₃ phase (including interfacial control, diamond surface chemical modification, diamond surface modified coating and matrix alloying, etc.) on the interface and thermal conductivity of composites are described in detail. Finally, the development direction of diamond/Al composite heat dissipation materials in future is prospected.