Bonding mechanism of ply during automated tape laying process

The bonding mechanism of adjacent plies during the tap laying process was discussed, and the bonding process was modeled as squeezing flow of resin patch under parallel plate. It is pointed out that when the viscosity of resin is constant, the bonding capability will become stronger when infiltration effect of the interface becomes better. The calculation formula of the infiltration effect was deduced by using fluid mechanics theory. Influence of main processing parameters (layup pressure, layup velocity, etc.) on infiltration effect and bonding capability was analyzed. The peel force was used to quantify the bonding capability of the ply. A series of experiments were carried out on the automated tape laying platform. It is shown that the bonding capability will become weaker as the layup velocity increases, and become stronger as layup pressure, mould temperature and roller radius increase. This law conforms to the calculation formula of the infiltration effect.