LIANG Xi, LI Huijian, YU Wei, et al. A numerical simulation on the coefficient of thermal expansion of hollow particle filled resin syntacnic foam[J]. Acta Materiae Compositae Sinica, 2013, 30(3): 233-239.
Citation:
|
LIANG Xi, LI Huijian, YU Wei, et al. A numerical simulation on the coefficient of thermal expansion of hollow particle filled resin syntacnic foam[J]. Acta Materiae Compositae Sinica, 2013, 30(3): 233-239.
|
LIANG Xi, LI Huijian, YU Wei, et al. A numerical simulation on the coefficient of thermal expansion of hollow particle filled resin syntacnic foam[J]. Acta Materiae Compositae Sinica, 2013, 30(3): 233-239.
Citation:
|
LIANG Xi, LI Huijian, YU Wei, et al. A numerical simulation on the coefficient of thermal expansion of hollow particle filled resin syntacnic foam[J]. Acta Materiae Compositae Sinica, 2013, 30(3): 233-239.
|
A numerical simulation on the coefficient of thermal expansion of hollow particle filled resin syntacnic foam
-
Key Laboratory of Mechanical Reliability for Heavy Equipment and Large Structure of Hebei Province, Yanshan University, Qinhuangdao 066004, Hebei, China
- Received Date: 2012-05-07
- Rev Recd Date:
2012-09-13
- Publish Date:
2013-06-15