STUDY OF CURING REACTION AND TECHNOLOGY PARAMETERS OF COMPOSITE ADHESIVE

The paper is about measuriug curing ruction of SY-25 adhcsiv DSC-7 of PFRKIN-ELMER Company.Kinetic parameters of curing reaction activation energy, reaction order and pre-exponcntial factor can be obtained based on the kinetic equation which is constructed.in accordance with the measuring principle of DSC-7.Using the kinetic parameters,the relationship among degree of curing,curing temporeture and curing time is predicted.This work may be used to proviole a throretical data for making curing technology parameters of SY-25 adhesive.