Wu Jianxin, Li Pengxing, Wu Renjie, et al. EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 63-67.
Citation:
Wu Jianxin, Li Pengxing, Wu Renjie, et al. EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 63-67.
Wu Jianxin, Li Pengxing, Wu Renjie, et al. EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 63-67.
Citation:
Wu Jianxin, Li Pengxing, Wu Renjie, et al. EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 63-67.
EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS
Based on the kinetics of interfacial reaction in C/Al composite materials established in reference 1,the kinetics of interfacial reaction zone is measured by Scanning Auger Microprobe Depth Profile for simulated C/Al-Ti and C/Al-Cu specimens subjected to various annealing procedures.The activation energy of interfacial reaction is ordered increasingly as C/Al-Ti, C/Al-Cu and C/Al.
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