Ding Feng, Xie Weizhang. THERMALLY CONDUCTIVE COMPOSITES[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 19-24.
Citation: Ding Feng, Xie Weizhang. THERMALLY CONDUCTIVE COMPOSITES[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 19-24.

THERMALLY CONDUCTIVE COMPOSITES

  • Received Date: 1991-09-20
  • Publish Date: 1993-09-01
  • In the study,a new thermal conduction model is proposed for filled Epoxy resins with metal particles.The modelis fundamentally based on the generalization of vertically and horizonally ideal conduction model of composites and is modified in considering that the parameters have influrcences on thermally conductive composites. The following equation is ceived from the new model: ln(Kc)=G(f)×ln(Kv)+[1-G(f)]×lnKh. Once all parameters are known,the thermal conductivity of resin composites filled with particles cmn be evaluated,The calculated values coincide with the experimental data.

     

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