STUDY OF POST TREATMENT FOR AN IMPROVED BMI MATRIX PRINTED CIRCUIT BOARD
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Abstract
The post treatment for an improved BMI matrix printed circuit board was studied by using differential scanning calorimetry etc.Based on the principles of DSC,a kinetic equation was obtained and the results computed showed that 100% degree of cure might be achieved after the improved BMI resin was treated at 200℃ for 5 hrs.However,DMA temperature spectra revealed that curing could not be fully completed until the resin had been treated at 200℃ for 10 hrs.It was also found that a relationship existed between the curing degree,the height of the damping peak at low temperatures,and,thereby,the motion of the segments of the network molecules.
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