Chen Ping, Liu Shengping, Chen Hui, et al. EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER[J]. Acta Materiae Compositae Sinica, 1997, 14(3): 67-71.
Citation: Chen Ping, Liu Shengping, Chen Hui, et al. EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER[J]. Acta Materiae Compositae Sinica, 1997, 14(3): 67-71.

EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER

  • Influence of temperature and boiling time on the dielectrical property of glass fiber (before and after the glass fiber is treated with five kinds of coupling agents)/epoxy resin matrix composite interface was studied. The results show that there is a strong effect of temperature and boiling time on the dielectrical property of glass fiber/epoxy matrix composite int erface, and that its improvement range depends on the polarization intensity of the interface.
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