EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER

Chen Ping; Liu Shengping; Chen Hui; Liu Qixian

Article Contents

Article Navigation > Acta Materiae Compositae Sinica > 1997 > 14(3): 67-71

Chen Ping, Liu Shengping, Chen Hui, et al. EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER[J]. Acta Materiae Compositae Sinica, 1997, 14(3): 67-71.

Citation:

Chen Ping, Liu Shengping, Chen Hui, et al. EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER[J]. Acta Materiae Compositae Sinica, 1997, 14(3): 67-71.

Citation:

PDF( 200 KB)

EFFECT OF TEMPERATURE AND BOILING TIME ON DIELECTRICAL PROPERTIES OF GLASS FIBER/EPOXY MATRIX COMPOSITE INTERFACE LAYER

1.
Harbin University of Science and Technology, Harbin 150040;
2.
Harbin FRP Research Institute, Harbin 150036

Received Date: 1995-12-10
Rev Recd Date: 1996-05-06
Publish Date: 1997-09-01

Abstract

Abstract

Influence of temperature and boiling time on the dielectrical property of glass fiber (before and after the glass fiber is treated with five kinds of coupling agents)/epoxy resin matrix composite interface was studied. The results show that there is a strong effect of temperature and boiling time on the dielectrical property of glass fiber/epoxy matrix composite int erface, and that its improvement range depends on the polarization intensity of the interface.
- interface layer,
- composite,
- coupling agent,
- wetting,
- temperature,
- boiling time,
- dielectrical property
Long Abstrsct
Innovation Points