KANG Boqi, YAN Peng, JIANG Chiping. A random microstructure cell model to predict the effective thermal conductivity of fiber reinforced composites[J]. Acta Materiae Compositae Sinica, 2012, (5): 140-145.
Citation:
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KANG Boqi, YAN Peng, JIANG Chiping. A random microstructure cell model to predict the effective thermal conductivity of fiber reinforced composites[J]. Acta Materiae Compositae Sinica, 2012, (5): 140-145.
|
KANG Boqi, YAN Peng, JIANG Chiping. A random microstructure cell model to predict the effective thermal conductivity of fiber reinforced composites[J]. Acta Materiae Compositae Sinica, 2012, (5): 140-145.
Citation:
|
KANG Boqi, YAN Peng, JIANG Chiping. A random microstructure cell model to predict the effective thermal conductivity of fiber reinforced composites[J]. Acta Materiae Compositae Sinica, 2012, (5): 140-145.
|