Investigation of grinding characteristics and removal mechanisms of 2D-C/SiC in high speed deep grinding

The grinding experiments were conducted on 2D-C/SiC composites by using resin bond diamond wheel in this work. The ground surface/subsurface damages were observed. The theory expression of grinding force for the friction layer (surface) of 2D-C/SiC was proposed, and the effect of grinding machining process amount on grinding force and force ratio was also discussed. The result indicates that the removal mechanisms involved in the grinding process for 2D-C/SiC composites are dominated by their brittleness fractures and related to their microstructures, which are different from those of ordinary plastic and brittle materials.