Preparation and properties of nano-SiO₂/epoxy resin diamond whetstone

Using liquid epoxy resin as the bond, diamond as the abrasive and nano-SiO₂ as the reinforcement, diamond whetstones were prepared by casting process, and the properties were studied. The results show that with the addition of 0.25% mass ratio of accelerant to molding compound, whetstones can be cured at 130℃/4 h+160℃/2 h. As diamond modified by silane coupling agent and Ni-coated, the wear resistance of whetstone is improved by 15.0% and 32.5%, respectively. Nano-SiO₂ modified by silane coupling agent is homodispersed in the whetstone, and the bend strength of whetstone can be improved. While the mass fraction of nano-SiO₂ is 4%, the flexural strength and Rockwell hardness reach the maximum, i. e. 106 MPa and HRB 56, respectively.