Influence of slenderness ratio on the percolation threshold of conductive adhesives

Nanostructured silver with different slenderness ratio was prepared by a microwave (MW) assisted method. The nano-silvers were characterized by scanning electron microscope (SEM) and X-ray diffraction (XRD). Isotropical conductive adhesive (ICA) was prepared by using the different slenderness ratio nano-silver as the conductive filler. The conductivity of the adhesive was measured by four-points method. The results indicate that the slenderness ratio of the nano-silver has important influence on it’s percolation threshold. A feasible modified threshold theory was put forward to simulate the relationship between ratio and threshold. The simulation results agree well with the experimental results.