TENSILE BEHAVIOR OF COMPOSITELAMINATES WITHONE-SIDE BONDED REPAIR

The tensile failure mechanism of composite laminates with the damage of a hole was studied af ter beingrepaired with one-sided bonding. The out-of-plane displacement of the center point of the repaired laminates, tensilest rength and st rain dist ribution were measured. The influence of the patch size and thickness on tensile st rengthof the repaired laminates was examined experimentally. The result s demonst rate that increasing the patch thicknessand it s diameter can improve motherboard tensile st rength. However, enhancing the thickness of the patch will increase the out-of-plane displacement of the laminates. When undertaking computational analysis of one-side bondedlaminates without any support on the unloaded side, it is necessary to consider the effect s of the bending moment resulted f rom the eccent ric load. A three-dimensional finite element analysis was performed to detect the failure mechanism and predict the tensile st rength of the repaired specimens with delamination criterion. It was found that thefailure began in the first interface of the motherboard under the patch at the edge of hole or the patch. The analysisdata are good agreement with the test results.