YAO Zaiqi, GE Jiping, LIU Shuhua. STRENGTH AND CONDUCTIVITY OF DEFORMATION-PROCESSEDCu-11.5 %Fe IN SI TU COMPOSITE[J]. Acta Materiae Compositae Sinica, 2005, 22(3): 121-125.
Citation: YAO Zaiqi, GE Jiping, LIU Shuhua. STRENGTH AND CONDUCTIVITY OF DEFORMATION-PROCESSEDCu-11.5 %Fe IN SI TU COMPOSITE[J]. Acta Materiae Compositae Sinica, 2005, 22(3): 121-125.

STRENGTH AND CONDUCTIVITY OF DEFORMATION-PROCESSEDCu-11.5 %Fe IN SI TU COMPOSITE

  • Received Date: 2004-05-25
  • Rev Recd Date: 2004-10-22
  • Publish Date: 2005-06-15
  • St ructure, st rength and elect rical conductivity of Cu-11.5 %Fe in si tu composite obtained by cold drawing or cold drawing combined with intermediate heat treatments were investigated. The structures of the compositeswere examined by SEM and TEM. The result s indicate that the Fe dendrites were drawn into fine ribbons and the Feribbons are curl and fold in cross-section at st rainη ≥5.37. The fine ribbons are finer and more uniform with thest rain increasing. The experimental result s show that the tensile st rength and elect rical resistivity increase with theincreasing of deformation st rain. Af ter intermediate heat t reatment s, the st rength remains, but the elect rical resistivity decreases drastically. The elect rical resistivity of the in si tu composite with different st rains can decrease about4.4μΩ·cm af ter a series of intermediate heat t reatment s. The good combinations of the elect rical conductivity andthe tensile st rength are the following : 70.6 % IACS ( International Annealed Copper Standard) / 659 MPa (Φ 0.8),64.6 % IACS/ 752 MPa (Φ0.5) and 51.9 % IACS/ 880 MPa (Φ0.2) .

     

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