ZHANG Ji-kui, GUAN Zhi-dong, LI Zheng-neng. Three-dimensional f inite element analysis for the temperaturef ield of thermoset composites during cure process[J]. Acta Materiae Compositae Sinica, 2006, 23(2): 175-179.
Citation: ZHANG Ji-kui, GUAN Zhi-dong, LI Zheng-neng. Three-dimensional f inite element analysis for the temperaturef ield of thermoset composites during cure process[J]. Acta Materiae Compositae Sinica, 2006, 23(2): 175-179.

Three-dimensional f inite element analysis for the temperaturef ield of thermoset composites during cure process

  • Received Date: 2005-08-09
  • Rev Recd Date: 2005-11-16
  • Publish Date: 2006-04-15
  • Based on the thermal conduct theory and cure kinetics , the history of cure temperature and degree ofcure was investigated for the orthot ropic laminate during curing. The temperature and degree of cure were chosen astwo additional degrees of nodes in FEM models , and the coupling of them was taken into account . The result showsthat : for the thick laminate , the peak value of the temperature was increased , and the initiation of the crosslinkingreaction at the center point was late ; for the laminates with different fiber content s , the development of the degree ofcure is synchronic at the early stage of the curing process , when the temperature is higher than that of the dwell(85 ℃) , the lower the fiber content in the laminates , the higher the peak value of temperature at the center of thelaminates , and it s corresponding time is quicker.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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