SHI Feng, DUAN Yue-xin, LIANG Zhi-yong, et al. Rheological behavior of a bismaleimide resin system for RTM process[J]. Acta Materiae Compositae Sinica, 2006, 23(1): 56-62.
Citation:
|
SHI Feng, DUAN Yue-xin, LIANG Zhi-yong, et al. Rheological behavior of a bismaleimide resin system for RTM process[J]. Acta Materiae Compositae Sinica, 2006, 23(1): 56-62.
|
SHI Feng, DUAN Yue-xin, LIANG Zhi-yong, et al. Rheological behavior of a bismaleimide resin system for RTM process[J]. Acta Materiae Compositae Sinica, 2006, 23(1): 56-62.
Citation:
|
SHI Feng, DUAN Yue-xin, LIANG Zhi-yong, et al. Rheological behavior of a bismaleimide resin system for RTM process[J]. Acta Materiae Compositae Sinica, 2006, 23(1): 56-62.
|
Rheological behavior of a bismaleimide resin system for RTM process
- Received Date: 2005-03-04
- Rev Recd Date:
2005-07-04
- Publish Date:
2006-02-15