Biphenyl polyimide composite endcapped with phenylethynyl

High temperature biphenyl polyimide resin endcapped with phenylethynyl was prepared using the modified polymerization monomeric reactant s method (MPMR) . The polyimide composite was fabricated by press molding , and the processing technique was discussed also. The polyimide composite shows high thermal stability at371 ℃. The mechanical properties of the composite at 371 ℃can maintain as much as 50 % of mechanical propertiesat room temperature. The glass t ransition temperature of the polyimide composite is 449 ℃. The mass loss at 371 ℃in air is less than 3 % over 100 h at 371 ℃. The obtained polyimide composite achieves the basic demands of the hightemperature resin at 371 ℃.