Fabrication on electronic package box of SiC_P/ Al composites with high volume fraction of SiC_P

The SiC_P preformed compact was prepared by Powder Injection Molding ( PIM) , and the melting aluminum penet rated into the SiC_P preformed compact by the pressure infilt ration method to manufacture the elect ronicpackage box of SiC_P (65 %) / Al composites. SiC_P (65 %) / Al composite manufactured by pressure infilt ration has highdensity and homogeneous microst ructure. The density of the composite is 2. 98 g/ cm³ ; the thermal expansion coefficient and thermal conductivity of the composite are 8. 0 ×10 ^-6 / K and nearly 130 W/ (m·K) at room temperature ,respectively , which is up to the request of the elect ronic package.