Isotropical conductive adhesives filled with silver nanowires

With the nanoporous templates formed by the cont rolled hydrolysis and condensation of butyl titanate( Ti (OC₄H₉)₄ ) , silver (Ag) nanowires with a slenderness ratio of 50～60 were prepared by using silver nit rate (AgNO₃ ) as precursor. The prepared Ag nanowires were characterized by X-ray diff raction (XRD) and t ransmissionelect ro microscopy ( TEM) . A new kind of isot ropical conductive adhesive ( ICA) was developed by using these Agnanowires as conductive filler. The bulk resistivity and shear st rength testing results show that the novel ICA filledwith Ag nanowires (mass f raction 56 %) has bulk resistivity (1. 2 ×10^-4Ω·cm) 6 times lower than that of ICA filledwith Ag particles (mass f raction 75 %) . For the lower filler content , the ICA filled with Ag nanowires exhibit shigher shear st rength (17. 6 MPa on Al subst rate) than the ICA filled with micrometer-sized Ag particles or nanometer-sized Ag particles cloes.