| Citation: |
BAI Long, WANG Panpan, WANG Baoli, et al. Research progress on flexible thermal conductive materials[J]. Acta Materiae Compositae Sinica, 2025, 42(3): 1178-1191. DOI: 10.13801/j.cnki.fhclxb.20240829.001
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With the development of electronic devices in the direction of high integration, high power and multifunctionality, as well as the rise of new flexible devices such as wearable devices, flexible displays and soft robots, higher requirements have been put forward for the efficient heat dissipation and flexible deformable ability of the devices, so flexible thermal conductive materials have received more and more attention, and have a broad application prospect. This paper summarizes the research progress and current status of flexible thermal conductive materials, compares and analyzes the advantages and disadvantages of the three major types of flexible thermal conductive materials, namely, carbon-based, polymer-based and liquid metal-based, and points out that the composite flexible thermal conductive materials, which are both excellent in thermal conductivity and flexibility, have profound development potential and practical value.
This review article delves into the key research progress of flexible heat dissipation materials, with the aim of addressing the heat dissipation challenges faced by current electronic devices, especially flexible electronic devices, while pursuing high performance. The article focuses on the main types of flexible heat dissipation materials such as carbon based materials, polymer composites, and liquid metals, and analyzes their potential and application prospects in achieving efficient heat dissipation and maintaining mechanical flexibility.The article adopts the method of literature review to systematically sort out the synthesis strategies, performance characterization, and application examples of various flexible heat dissipation materials in flexible electronic devices. For carbon based materials, the preparation techniques of graphene and carbon nanotubes, such as chemical vapor deposition, mechanical exfoliation, and electrochemical methods, were analyzed in detail, and their advantages and challenges in thermal management were discussed. In the polymer based materials section, the selection and dispersion techniques of thermal conductive fillers, as well as the interface bonding with the matrix, were discussed, specifically involving various fillers such as metals, ceramics, composite materials, and carbon materials. In terms of liquid metal, its potential as a heat dissipation enhancement material was evaluated, and its limitations and possible solutions in practical applications were analyzed.The review found that carbon based nanoflexible materials are mainly carbon nanotubes and graphene, which have ultra-high thermal conductivity, far higher than other thermal conductive fillers. According to recent research, carbon based materials have significant advantages in thermal conductivity and flexibility, and the corresponding preparation methods are relatively mature. Polymer flexible heat dissipation materials usually use high molecular weight polymers as the matrix, add appropriate amounts of high thermal conductivity fillers to enhance the thermal conductivity of the material, increase the proportion of thermal conductivity fillers used, strengthen the bonding between fillers and matrix, and use high aspect ratio fillers to reduce the number of interfaces in the material, all of which are beneficial for improving the thermal conductivity of this type of thermal interface material. Comparing several different fillers: 1) Metal fillers are moderately priced and widely used. Compared to metal particles, metal nanowires can significantly improve the flexibility of materials while ensuring thermal conductivity. Array filling and modification of metal nanowires can further enhance heat dissipation performance. 2) Carbon based fillers have the highest thermal conductivity compared to metal and ceramic fillers, with a thermal conductivity of up to 1428 W/(m · K), excellent heat dissipation performance, and good flexibility. 3) Ceramic fillers are suitable for insulation applications, but their thermal conductivity is generally low. Although a few studies have achieved high thermal conductivity, further research is still needed. 4) Composite fillers refer to fillers that mix the above three types of fillers, which can combine the advantages of each filler and have broad exploration space. Liquid metal has the characteristics of good thermal conductivity, high boiling point, and large temperature difference between melting point and boiling point. When liquid metal melts, it can fill the air gap and significantly reduce the contact resistance. The composition of low melting point alloys can be selected according to the desired melting point. However, the fluidity of liquid metal is too good, and direct use alone can easily cause overflow and short circuits. In practical applications, liquid metal will be mixed with other materials to reduce its fluidity. Phase change flexible interface heat dissipation materials can greatly improve heat dissipation performance and prevent instantaneous heating and heat dissipation problems such as short circuits, while ensuring performance stability within the functional range.The research and development of flexible heat dissipation materials are rapidly advancing towards improving thermal conductivity, enhancing flexibility, and improving environmental stability. Future work needs to focus on the following areas: firstly, developing new and efficient thermal conductive fillers that are cost-effective and easy to process; The second is to optimize the microstructure of composite materials, reduce interfacial thermal resistance, and improve the overall thermal conductivity efficiency of the material; The third is to improve the environmental stability and durability of materials, ensuring their reliability in long-term applications; The fourth is to strengthen interdisciplinary cooperation and develop new flexible heat dissipation materials with integrated functions by combining knowledge from fields such as electronic engineering, materials science, and mechanical engineering.
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