Citation: | ZHANG Qingyun, HUANG Junchen, YANG Bing, et al. Configuration design and thermal properties of diamond reinforced graphite film/aluminum composite[J]. Acta Materiae Compositae Sinica, 2024, 41(8): 4344-4352. doi: 10.13801/j.cnki.fhclxb.20240025.001 |
[1] |
王菁. 电子设备的散热技术分析[J]. 电子技术, 2022, 51(7): 184-185.
WANG Jing. Analysis of heat dissipation technology of electronic equipment[J]. Electronic Technology, 2022, 51(7): 184-185(in Chinese).
|
[2] |
MALLIK S, EKERE N, BEST C, et al. Investigation of thermal management materials for automotive electronic control units[J]. Applied Thermal Engineering, 2011, 31(2-3): 355-362. doi: 10.1016/j.applthermaleng.2010.09.023
|
[3] |
陈贞睿, 刘超, 谢炎崇, 等. 高导热金属基复合材料的制备与研究进展[J]. 粉末冶金技术, 2022, 40(1): 40-52.
CHEN Zhenrui, LIU Chao, XIE Yanchong, et al. Preparation and research process of high thermal conductivity metal matrix composites[J]. Powder Metallurgy Technology, 2022, 40(1): 40-52(in Chinese).
|
[4] |
FENG C P, SUN K Y, JI J C, et al. 3D printable, form stable, flexible phase-change-based electronic packaging materials for thermal management[J]. Additive Manufacturing, 2023, 71: 103586. doi: 10.1016/j.addma.2023.103586
|
[5] |
HUANG Y, OUYANG Q, GUO Q, et al. Graphite film/aluminum laminate conductivity for thermal management applications[J]. Materials & Design, 2016, 90: 508-515.
|
[6] |
黄宇. 高导热石墨膜/铝复合材料的设计、制备与性能研究[D]. 上海: 上海交通大学, 2017.
HUANG Yu. Design, fabrication and thermal properties of high thermal conductive graphite film/aluminum composites[D]. Shanghai: Shanghai Jiao Tong University, 2017(in Chinese).
|
[7] |
孙铭. 石墨膜/Al-Mg-Si层状复合材料界面性质及组织性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2022.
SUN Ming. Research on interfacial properties, microstructure and properties of graphite film/Al-Mg-Si laminated composites[D]. Harbin: Harbin Institute of Technology, 2022(in Chinese).
|
[8] |
CHANG J, ZHANG Q, LIN Y, et al. Layer by layer graphite film reinforced aluminum composites with an enhanced performance of thermal conduction in the thermal management applications[J]. Journal of Alloys and Compounds, 2018, 742: 601-609. doi: 10.1016/j.jallcom.2018.01.332
|
[9] |
田聪. 石墨膜/铝导热复合基板的制备与散热应用研究[D]. 哈尔滨: 哈尔滨工业大学, 2020.
TIAN Cong. Preparation and application of heat dissipation of graphite film/aluminum thermal conductive substrates[D]. Harbin: Harbin Institute of Technology, 2020(in Chinese).
|
[10] |
宁越洋. 表面改性石墨铜/铝力学性能及导热率研究[D]. 武汉: 江汉大学, 2020.
NING Yueyang. Study on mechanical properties and thermal conductivity of surface-modified graphite copper aluminum[D] Wuhan: Jianghan University, 2020(in Chinese).
|
[11] |
佟兴宇. 微波改性石墨膜/铝层状复合材料的显微组织与热性能研究[D]. 哈尔滨: 哈尔滨工业大学, 2019.
TONG Xingyu. Microstruture and thermal properties of microwave modified graphite film/aluminum composites[D]. Harbin: Harbin Institute of Technology, 2019(in Chinese).
|
[12] |
PENG X, HUANG Y, HAN X, et al. High volume fraction of copper coated graphite flake/nitrogen doped carbon fiber reinforced aluminum matrix composites[J]. Journal of Alloys and Compounds, 2020, 822: 153584. doi: 10.1016/j.jallcom.2019.153584
|
[13] |
INAGAKI M, KABURAGI Y, HISHIYAMA Y. Thermal management material: Graphite[J]. Advanced Engineering Materials, 2014, 16(5): 494-506. doi: 10.1002/adem.201300418
|
[14] |
LIU Q, HE X B, REN S B, et al. Thermophysical properties and microstructure of graphite flake/copper composites processed by electroless copper coating[J]. Journal of Alloys and Compounds, 2014, 587: 255-259. doi: 10.1016/j.jallcom.2013.09.207
|
[15] |
DOO J H, HA M Y, MIN J K, et al. Theoretical prediction of longitudinal heat conduction effect in cross-corrugated heat exchanger[J]. International Journal of Heat and Mass Transfer, 2012, 55(15-16): 4129-4138. doi: 10.1016/j.ijheatmasstransfer.2012.03.054
|
[16] |
LIN Q H, HE S, LIU Q Q, et al. Construction of a 3D interconnected boron nitride nanosheets in a PDMS matrix for high thermal conductivity and high deformability[J]. Composites Science and Technology, 2022, 226: 109528. doi: 10.1016/j.compscitech.2022.109528
|
[17] |
YANG J, QI G Q, LIU Y, et al. Hybrid graphene aerogels/phase change material composites: Thermal conductivity, shape-stabilization and light-to-thermal energy storage[J]. Carbon, 2016, 100: 693-702. doi: 10.1016/j.carbon.2016.01.063
|
[18] |
PINES M L, BRUCK H A. Pressureless sintering of particle-reinforced metal-ceramic composites for functionally graded materials: Part I. Porosity reduction models[J]. Acta Materialia, 2006, 54(6): 1457-1465. doi: 10.1016/j.actamat.2005.10.060
|
[19] |
GU Q, PENG J, XU L, et al. Preparation of Ti-coated diamond particles by microwave heating[J]. Applied Surface Science, 2016, 390: 909-916. doi: 10.1016/j.apsusc.2016.08.168
|
[20] |
YANG W, PENG K, ZHOU L, et al. Finite element simulation and experimental investigation on thermal conductivity of diamond/aluminium composites with imperfect interface[J]. Computational Materials Science, 2014, 83: 375-380. doi: 10.1016/j.commatsci.2013.11.059
|
[21] |
代晨. W涂层对金刚石增强铝基复合材料组织与性能的影响[D]. 哈尔滨: 哈尔滨工业大学, 2016.
DAI Chen. Microstructure and properties of tungsten coated diamond/aluminum composites[D]. Harbin: Harbin Institute of Technology, 2016(in Chinese).
|
[22] |
ZHOU H, RAN M, LI Y, et al. Improvement of thermal conductivity of diamond/Al composites by optimization of liquid-solid separation process[J]. Journal of Materials Processing Technology, 2021, 297: 117267. doi: 10.1016/j.jmatprotec.2021.117267
|
[23] |
ZHANG C, CAI Z, WANG R, et al. Microstructure and thermal properties of Al/W-coated diamond composites prepared by powder metallurgy[J]. Materials & Design, 2016, 95: 39-47.
|
[24] |
XIN L, TIAN X, YANG W, et al. Enhanced stability of the diamond/Al composites by W coatings prepared by the magnetron sputtering method[J]. Journal of Alloys and Compounds, 2018, 763: 305-313. doi: 10.1016/j.jallcom.2018.05.310
|
[25] |
BERGSTROM D B, PETROV I, GREENE J E. Al/Ti xW1− x metal/diffusion-barrier bilayers: Interfacial reaction pathways and kinetics during annealing[J]. Journal of Applied Physics, 1997, 82(5): 2312-2322. doi: 10.1063/1.366039
|
[26] |
WEBER L, TAVANGAR R. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X=Cr, B) diamond composites[J]. Scripta Materialia, 2007, 57(11): 988-991. doi: 10.1016/j.scriptamat.2007.08.007
|
[27] |
CHE Z, ZHANG Y, LI J, et al. Nucleation and growth mechanisms of interfacial Al4C3 in Al/diamond composites[J]. Journal of Alloys and Compounds, 2016, 657: 81-89. doi: 10.1016/j.jallcom.2015.10.075
|
[28] |
ZHU P, ZHANG Q, QU S, et al. Effect of interface structure on thermal conductivity and stability of diamond/aluminum composites[J]. Composites Part A: Applied Science and Manufacturing, 2022, 162: 107161. doi: 10.1016/j.compositesa.2022.107161
|
[29] |
ZHANG C, WANG R, CAI Z, et al. Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing[J]. Surface and Coatings Technology, 2015, 277: 299-307. doi: 10.1016/j.surfcoat.2015.07.059
|
[30] |
LEE M T, FU M H, WU J L, et al. Thermal properties of diamond/Ag composites fabricated by eletroless silver plating[J]. Diamond and Related Materials, 2011, 20(2): 130-133. doi: 10.1016/j.diamond.2010.11.017
|