Volume 38 Issue 1
Jan.  2021
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ZHAO Haocheng, LIANG Fangnan, LIU Qianxiu, et al. Anodic bonding applied to flexible packaging using polymer elastomer composites[J]. Acta Materiae Compositae Sinica, 2021, 38(1): 111-119. doi: 10.13801/j.cnki.fhclxb.20200519.002
Citation: ZHAO Haocheng, LIANG Fangnan, LIU Qianxiu, et al. Anodic bonding applied to flexible packaging using polymer elastomer composites[J]. Acta Materiae Compositae Sinica, 2021, 38(1): 111-119. doi: 10.13801/j.cnki.fhclxb.20200519.002

Anodic bonding applied to flexible packaging using polymer elastomer composites

doi: 10.13801/j.cnki.fhclxb.20200519.002
  • Received Date: 2020-03-26
  • Accepted Date: 2020-05-05
  • Available Online: 2020-05-19
  • Publish Date: 2021-01-15
  • Three kinds of polymer elastomer (PEO-PUEs) composites as cathode materials for anodic bonding were prepared via pre-polymerization method casted and cured at room temperature. The PEO-PUEs composites were characterized by good heat resistance that the 5% thermal decomposition temperatures Td,5% are higher than 250℃. The glass transition temperatures Tg are lower than −40℃ showing good flexibility. The PEO-PUEs composites have good mechanical properties. All PEO-PUEs composites have high ionic conductivity meeting the requirements of anodic bonding for cathode materials, and the highest value at 65℃ (the temperature required for anodic bonding) is reached to 1.50×10−3 S·cm−1 for PEO-PUEs composites (butane-1,4-diol (BDO) content is 50wt%, trimethylolpropane (TMP) content is 50wt% and SiO2 content is 1wt%). The anodic bonding by thermal guidance and dynamic field for polymer materials was designed, which was successfully used for jointing of PEO-PUEs composites with Al foil. When BDO content is 50wt%, TMP content is 50wt% and SiO2 content is 1wt%, the PEO-PUEs composites with Al foil have the best bonding performance, and the highest value of tensile strength can reach to 1.26 MPa. Compared with the traditional anodic bonding, the joint of PEO-PUEs composites with Al by anodic bonding designed with thermal guidance and dynamic field have a stable and dense intermediate bonding layer, and the peak current and bonding time are significantly improved, and the bonding interface strengthes are higher. This study provides some theoretical basis and reference experience for the practical application of anodic bonding in flexible packaging from the aspects of preparing polymer cathode materials and designing the corresponding anodic bonding process.

     

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