LU Chenjun, XU Jun, PEI Xiwei, et al. Decline and restrain for the thermal conductivity of diamond/Al (or AlSi alloy) composites[J]. Acta Materiae Compositae Sinica, 2019, 36(3): 669-676. doi: 10.13801/j.cnki.fhclxb.20180530.005
Citation: LU Chenjun, XU Jun, PEI Xiwei, et al. Decline and restrain for the thermal conductivity of diamond/Al (or AlSi alloy) composites[J]. Acta Materiae Compositae Sinica, 2019, 36(3): 669-676. doi: 10.13801/j.cnki.fhclxb.20180530.005

Decline and restrain for the thermal conductivity of diamond/Al (or AlSi alloy) composites

doi: 10.13801/j.cnki.fhclxb.20180530.005
  • Received Date: 2018-03-10
  • Rev Recd Date: 2018-05-17
  • Publish Date: 2019-03-15
  • Diamond/Al, diamond/AlSi7 and diamond/AlSi9 composites were fabricated by using gas pressure infiltration, and the decline behaviors for the thermal conductivity of the composites when exposed to the air were analyzed. The results show that the reaction product Al4C3 between the diamond and the molten Al can decompose into Al(OH)3 in the humid air, resulting in the decline for the thermal conductivity of diamond/Al composites. Adding element Si into Al is found to inhibit the decline rate effectively, the mechanism of which are as follows:decrease in the amount of Al4C3 because of the decrease in the solubility of C of diamond in molten Al and the preferential precipitation of eutectic Si on diamond; increase in the density of the diamond/AlSi composites to prevent the contact between Al4C3 and moisture. Some methods of inhibiting the decline of the thermal conductivity of diamond/Al composites were also discussed, which is hopeful to prolong the service time of the composites in humid environment.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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