Research and prospect on interface strengthening methods for Ti/Mg bimetallic composites
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摘要: 钛/镁双金属复合材料兼具了钛和镁的优点，在航空航天、交通运输等领域具有巨大的潜在应用价值，近年来受到了国内外研究者的广泛关注。针对熔点差异大，弱反应，低互溶的钛、镁两种金属，采用中间层金属实现钛/镁界面冶金结合是典型的界面强化方法，界面冶金结合的调控是提高界面结合强度的核心，界面反应的控制和优化是界面强化的难点。本文综述了不同复合方法制备钛/镁双金属复合材料的研究进展，分析了界面组织演变对界面结合强度的影响；总结了在不同的复合方法下所采用的界面强化方法时，钛/镁双金属复合材料界面的失效强度；归纳了钛/镁双金属的界面强化机制，并对钛/镁双金属的界面强化后续研究进行展望。Abstract: Ti/Mg bimetallic composite possesses the virtues of both elements and is endowed with significant potential for multiple applications in fields such as aerospace, transportation, and others. Recently, it has been widely concerned by global scholars and researchers. Employing an interlayer metal as a typical means of interfacial strengthening to realize the metallurgical bonding of Ti and Mg alloys for a substantial discrepancy in melting points, weak metallurgical reaction, and low mutual solid solubility between Mg and Ti. The control and optimization of interfacial reaction are crucial in enhancing interfacial bonding strength, but also the difficulty of interfacial strengthening. Overview of research progress of Ti/Mg bimetallic composites fabricated by different join methods and analyzing the effect of interfacial microstructure on interfacial bonding strength was analyzed. The interfacial bonding strength with different interfacial strengthening methods under various join technology was listed. The Ti/Mg bimetallic interface bonding mechanism was summarized and the future research of Ti/Mg bimetallic interfacial strengthening has been prospected.
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图 4 采用不同镀层时镁/钛界面的形貌；(a) 电镀Ni[48]；(b) 纯Ni箔[47]；(c) Ni纳米颗粒[50]；(d) Cu纳米颗粒[50]；(e) Cu-Ni纳米颗粒[50]；(f) Cu-Ni箔[49]
AZ31—Grades of magnesium alloys; P1 and P2—Locations of EDS point scanning when investigating the microstructure; L1, L2, and L4—Reaction layer near the Mg side
Figure 4. SEM images of Mg/Ti interface with different coatings: (a) Electroplating Ni[48]; (b) Pure Ni foil[47]; (c) Ni nanoparticles[50]; (d) Cu nanoparticles[50]; (e) Cu-Ni nanoparticles[50]; (f) Cu-Ni foil[49]
图 6 不同温度下采用Ni做中间层时TC4/AZ91D双金属材料界面显微组织扫描图像：(a) 660℃；(b) 690℃；(c) 720℃；(d) 750℃[68]
A-G—Region used for high-magnification SEM imaging when investigating the middle layer tissue; I, II, and III—Three reaction layers
Figure 6. SEM images of interface microstructures of the TC4/AZ91D bimetals with nickel coating and at different temperature: (a) 660℃; (b) 690℃; (c) 720℃; (d) 750℃[68]
图 11 热力学模型计算结果：(a) 温度T=958 K时Al-Ni、Al-Mg、Mg-Ni和Mg-Ti二元熔体的生成焓ΔHAl-Ni、ΔHAl-Mg、ΔHMg-Ni和ΔHMg-Ti曲线图[71]；(b) T=2000 K时Mg-Ni、Mg-Al、Mg-Ti和Ni-Al、Ni-Ti、Al-Ti二元熔体的生成焓ΔHMg-Ni、ΔHMg-Al、ΔHMg-Ti、ΔHNi-Al、ΔHNi-Ti和ΔHAl-Ti曲线图[27]
X—Percentage of element content
Figure 11. Calculation results of thermodynamic model: (a) Temperature T=958 K, formation enthalpy ΔHAl-Ni, ΔHAl-Mg, ΔHMg-Ni and ΔHMg-Ti curves of Al-Ni, Al-Mg, Mg-Ni and Mg-Ti binary melts[71]; (b) T=2000 K, formation enthalpy ΔHMg-Ni, ΔHMg-Al, ΔHMg-Ti, ΔHNi-Al, ΔHNi-Ti, ΔHAl-Ti curves of Mg-Ni, Mg-Al, Mg-Ti and Ni-Al, Ni-Ti, Al-Ti binary melts[27]
表 1 钛/镁双金属复合材料的界面强化方法和失效强度
Table 1. Interfacial strengthening methods and failure strength of Ti/Mg bimetallic composites
Materials and join method Interface strengthening methods and bonding strength TA2/AZ31B CMT AZ61 welding wire—262 N/mm[13] AZ91 welding wire—242 N/mm[14] Ti/AZ31B TIG AZ31B welding wire—228 N/mm[18] TC4(Ti-6Al-4V)/AZ31B LW Electroplating Cu—2314 N (85.7% of AZ31B strength) AZ31B welding wire—200 MPa (85.1% of AZ31B strength)[20] AZ91 welding wire—2057 N (50% of AZ31B strength)[21] Electroplating Ni—2387 N (88.5% of AZ31B strength)[27] TC4/AZ31B CMT Al foil—72 MPa[45],
Ni foil—61 MPa[46],
Cu foil—61 MPa[46],
Ni/Cu laminated foil—57 MPa [49],
electroplating Ni—61 MPa[48]TC4/AZ31B hot rolling Al sheet—521 MPa[60] TC4/AZ91D solid-liquid
compound castingElectroplating Ni—105 MPa[71] Electroplating Cu—65 MPa[72] Hot dip plating Al—49 MPa[74] Hot dip plating Zn—34 MPa[73] Zn/Al—67 MPa [76] Hot dip plating TiAlSi—80 MPa[75] Magnetron sputtering FeCoNiCr HEA layer—94 MPa[77] TC4 lattice structure—77 MPa[78] TC4(10%)/AZ91D stir casting Al element—250 MPa[81] powder metallurgy Al element—303 MPa[97] Notes: TA2—Ti content is 99wt%; AZ31B—Al and Zn contents are 3wt% and 1wt%; CMT—Cold metal transfer; TIG—Tungsten inert gas welding; LW—Laser welding; AZ91D—Al and Zn content is 9wt% and 1wt% (The suffix letters B and D are identification codes used to identify different alloys with different specific components or small differences in element content); AZ61—Al and Zn contents are 6wt% and 1wt%; AZ91—Al and Zn contents are 9wt% and 1wt%; HEA—High-entropy alloy. 
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