树脂基复合材料制件微波固化数值模拟

龙习坤; 李树健; 陈蓉; 曹正; 李常平; 常腾飞

树脂基复合材料制件微波固化数值模拟

1.
湖南科技大学机电工程学院, 湘潭 411201
2.
湖南工程学院机械工程学院, 湘潭 411104

基金项目: 国家自然科学基金 (51975208); 湖南省自然科学基金 (2020 JJ4301)

详细信息

通讯作者:
李树健，博士，副教授，硕士生导师，研究方向为树脂基复合材料成型与切削加工技术　E-mail: smart0110@126.com

中图分类号: TQ327.3
计量
- 文章访问数: 98
- HTML全文浏览量: 43
- 被引次数: 0
出版历程
- 收稿日期: 2022-03-15
- 录用日期: 2022-04-10
- 修回日期: 2022-03-28
- 网络出版日期: 2022-04-29

Numerical simulation of microwave curing of resin matrix composites workpiece

1.
School of Mechanical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China
2.
School of Mechanical Engineering, Hunan Institute of Engineering, Xiangtan 411104, China

摘要

摘要: 以T800/X850(碳纤维/环氧树脂)复合材料T型制件为结合对象，利用COMSOL Multiphysics仿真软件，建立了反映复合材料制件单馈口谐振腔体微波固化的有限元仿真模型，研究了微波腔体和制件内部的电磁场、温度场、固化度场的分布规律及其与微波输入功率的映射关系。结果表明：在微波腔体内和制件内存在相反的电场强度分布，在复合材料制件内，远离微波馈入端口的区域的电场强度要高于近馈入端口区域，且在制件棱角区域，电场强度存在较强的尖端效应；随微波输入功率增加，微波腔体及制件内部的电场强度均随之增加，制件内电场强度最大值出现在上、下表面，且下表面温度明显较上表面高；提高微波输入功率会导致制件升温过快，进而诱发温度及固化度梯度。在升温中后期的制件厚度方向，温度和固化度梯度较明显。本研究推荐微波输入功率应控制在500 W以内。
- 树脂基复合材料 /
- 微波固化 /
- 固化温度 /
- 固化度 /
- 数值模拟
Abstract: Taking T800/X850 (carbon fiber/epoxy) composites T-shaped workpiece as the combined object, using COMSOL Multiphysics simulation software, the finite element simulation model reflecting the microwave curing of single feed resonant cavity of composites workpiece was established, and the distribution laws of electromagnetic field, temperature field and curing degree field inside the microwave cavity and workpiece and their mapping relationship with microwave input power were studied. The results show that there are opposite electric field intensity distributions in the microwave cavity and the workpiece. In the composite workpiece, the electric field intensity in the area far away from the microwave feed port is higher than that near the feed port, and there is a strong tip effect in the angular area of the workpiece; With the increase of microwave input power, the electric field intensity in the microwave cavity and the workpiece increases. The maximum electric field intensity appears on the upper and lower surfaces, and the temperature of the lower surface is significantly higher than that of the upper surface; Increasing the microwave input power will lead to the rapid temperature rise of the workpiece, and then induce the gradient of temperature and curing degree. In the middle and late stage of heating up, the gradient of temperature and curing degree is obvious. This study recommends that the microwave input power should be controlled within 500W.
- resin matrix composites /
- microwave curing /
- curing temperature /
- curing degree /
- numerical simulation

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图 1 T型制件微波固化建模示意图

Figure 1. Schematic diagram of microwave curing modeling of T-shaped workpiece

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图 2 微波固化数值模拟流程图

Figure 2. Flow chart of microwave curing numerical simulation

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图 3 T800/X850复合材料制件电磁场分布云图 (P_in=200 W)

Figure 3. Cloud diagram of electromagnetic field distribution of T800/X850 composites workpiece (P_in=200 W)

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图 4 T800/X850复合材料制件环境域及其域内的电场强度

Figure 4. Electric field strength in environment and in T800/X850 composites workpiece

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图 5 T800/X850复合材料制件域内中轴线的电场强度

Figure 5. Electric field intensity of central axis in T800/X850 composites workpiece

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图 6 T800/X850复合材料的电阻损耗-温度-输入功率关系

Figure 6. Relationship of resistance loss-temperature-input power of T800/X850 composites

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图 7 T800/X850复合材料固化工艺曲线与微波冷、热点分布：(a) 固化工艺曲线 (b)冷、热点分布

Figure 7. Curing curve and distribution of microwave cold and hot spot of T800/X850 composites: (a) curing curve (b) distribution of cold spot and hot spot

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图 8 T800/X850复合材料制件温度场分布云图 (P_in=200 W)

Figure 8. Cloud diagram of temperature field distribution of T800/X850 composites workpiece (P_in=200 W)

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图 9 微波输入功率对T800/X850复合材料升温过程的影响

Figure 9. Effect of microwave input power on temperature rising process of T800/X850 composites

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图 10 微波输入功率P_in对T800/X850复合材料制件固化度的影响

Figure 10. Effect of P_in on curing degree of T800/X850 composite workpiece

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图 11 T800/X850复合材料温度、固化度仿真与实验结果对比

Figure 11. Comparison between simulation and experimental results of temperature and curing degree of T800/X850 composite

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表 1 T800碳纤维/X850环氧树脂预浸料的材料属性^[16-18]

Table 1. Material properties of T800 carbon fiber/X850 epoxy resin prepregs^[16-18]

Parameter	Value
Relative dielectric constant	65-20j
Relative permeability	1
Conductivity (C_X, C_Y, C_Z)	(8696.45, 52.3, 52.3) s/m
Thermal conductivity in parallel fiber direction	−0.8863+0.0109T+0.2503α−0.3318 e⁻⁵T²−0.0286α² W/(m·K)
Thermal conductivity in vertical fiber direction	−0.5178+0.0055T+0.0784α−4.5880 e⁻⁶T²−0.0663α² W/(m*K)
Density	1570 kg/m³
Constant pressure heat capacity	−401.7+5.9T+135.1α−4.8723 e(−3)T² J/(kg·K)
Surface emissivity	1
Fiber volume fraction	0.65
Resin volume fraction	0.35
Notes：j is the imaginary part of the relative dielectric constant; C_X, C_Y and C_Z are conductivity in different directions; T is the instantaneous temperature of T800/X850 composites; α is the instantaneous curing degree of T800/X850 composites.

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表 2 T800/X850复合材料微波固化工艺数据

Table 2. Microwave curing process data of T800/X850 composites

P_in/W	Maximum curing gradient/%	t/s
200	5.9	3600
500	14.5	2000
1000	21	1500
1500	21.5	1200
2000	25	1000
Notes：P_in is microwave power; t is time required to achieve complete curing

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