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基于多功能插层结构的高导热碳纤维复合材料制备与表征

曹洪涛 程涛 孙征昊 陈立 李瑶瑶 胡秉晟

曹洪涛, 程涛, 孙征昊, 等. 基于多功能插层结构的高导热碳纤维复合材料制备与表征[J]. 复合材料学报, 2024, 41(8): 4096-4104. doi: 10.13801/j.cnki.fhclxb.20240229.004
引用本文: 曹洪涛, 程涛, 孙征昊, 等. 基于多功能插层结构的高导热碳纤维复合材料制备与表征[J]. 复合材料学报, 2024, 41(8): 4096-4104. doi: 10.13801/j.cnki.fhclxb.20240229.004
CAO Hongtao, CHENG Tao, SUN Zhenghao, et al. Preparation and characterization on carbon fiber composites with high thermal conductivity based on multifunctional intercalation structures[J]. Acta Materiae Compositae Sinica, 2024, 41(8): 4096-4104. doi: 10.13801/j.cnki.fhclxb.20240229.004
Citation: CAO Hongtao, CHENG Tao, SUN Zhenghao, et al. Preparation and characterization on carbon fiber composites with high thermal conductivity based on multifunctional intercalation structures[J]. Acta Materiae Compositae Sinica, 2024, 41(8): 4096-4104. doi: 10.13801/j.cnki.fhclxb.20240229.004

基于多功能插层结构的高导热碳纤维复合材料制备与表征

doi: 10.13801/j.cnki.fhclxb.20240229.004
基金项目: 上海市青年科技英才扬帆计划 (22YF1446900);国家自然科学基金青年科学基金(12002214)
详细信息
    通讯作者:

    曹洪涛,硕士,工程师,研究方向为多尺度增强碳纤维复合材料及其界面性能研究 E-mail: caoht0811@126.com

  • 中图分类号: TB333

Preparation and characterization on carbon fiber composites with high thermal conductivity based on multifunctional intercalation structures

Funds: Shanghai Sailing Program (22YF1446900); National Natural Science Foundation Youth Science Foundation (12002214)
  • 摘要: 随着碳纤维增强树脂基复合材料在航天领域中的广泛应用,结构/功能一体化碳纤维(CF)复合材料将发挥出重要作用。本文采用功能化层间技术(Functional interlayer technology,FIT)制备了高导热沥青基碳纤维增强氰酸酯复合材料。在短切碳纤维薄膜表面电泳沉积石墨烯片(GNPs)和Al2O3制备薄膜材料GNPs-Al2O3/CF作为多功能插层结构,以其取代纤维层之间的富树脂层区域。后者表现出良好的导热性能,正交铺层复合材料的面内热导率和面外热导率分别提高了123.1%和77.5%,准各向同性铺层复合材料的面内热导率和面外热导率分别提高了119.0%和50.0%。此外,多功能插层结构的加入可以阻碍裂纹的扩展,改善复合材料层间韧性。因此,多功能插层结构既能在层间形成有效的导热网络结构,改善复合材料面内和面外热导率,又能提高层间区域的增韧效率。

     

  • 图  1  薄膜制备技术路线图

    GNPs—Graphene sheets; CF—Carbon fiber; PU—Polyurethane; APAM—Anionic polyacrylamide

    Figure  1.  Roadmap of thin film preparation technology

    图  2  复合材料导热性能测试试样制备示意图

    FIT—Functional interlayer technology; CFRP—Carbon fiber reinforced polymer;FITin—The outermost layer of the specimen is CF; FITout—The outermost layer of the specimen is GNPs-Al2O3/CF

    Figure  2.  Schematic diagram of sample preparation for thermal conductivity testing of composite materials

    图  3  复合材料层间增韧测试试样制备示意图

    FITlft—Interlaminar fiber toughening based on FIT

    Figure  3.  Schematic diagram of sample preparation for interlayer toughening test of composite materials

    图  4  FITin、FITout和FITlft复合材料层合板试样成型工艺(a)和固化工艺(b)示意图

    Figure  4.  Schematic diagram of the molding process (a) and curing process (b) of FITin, FITout and FITlft composite laminates

    图  5  基于SEM的TC-HC-600碳纤维表面微观形貌:(a)表面含有上浆剂;(b)表面不含上浆剂;(c)电泳沉积修饰表面

    Figure  5.  Surface micromorphology of TC-HC-600 carbon fibers based on SEM: (a) Surface contains a sizing agent; (b) Surface does not contain sizing agent; (c) Surface electrodeposition modification

    图  6  基于AFM的TC-HC-600碳纤维表面微观形貌:(a)表面含有上浆剂;(b)表面不含上浆剂;(c)电泳沉积修饰表面

    Figure  6.  Surface micromorphology of TC-HC-600 carbon fibers based on AFM: (a) Surface contains a sizing agent; (b) Surface does not contain sizing agent; (c) Surface electrodeposition modification

    图  7  CF与GNPs-Al2O3/CF薄膜的表面接触角θ示意图

    Figure  7.  Schematic diagram of surface contact angle θ of CF and GNPs-Al2O3/CF thin film

    图  8  不同薄膜材料的面内(a)和面外(b)热导率

    Figure  8.  In plane (a) and out of plane (b) thermal conductivity of different thin film materials

    图  9  不同薄膜结构热传输路径示意图:(a) Al2O3热传输路径;(b) GNPs热传输路径;(c) GNPs-Al2O3热传输路径;(d)基于SEM的GNPs-Al2O3微观结构示意图

    Figure  9.  Schematic diagram of heat transfer paths for different thin film structures: (a) Heat transfer paths of Al2O3; (b) Heat transfer paths of GNPs; (c) Heat transfer paths of GNPs-Al2O3; (d) Microstructure diagram of GNPs-Al2O3 based on SEM

    图  10  正交铺层(a)和准各向同性铺层(b)复合材料层合板的热导和热扩散系数(c)

    Figure  10.  Thermal conductivity of composite laminates with orthogonality (a) and quasi-isotropy (b) ply structures and thermal diffusion coefficient (c)

    图  11  FITlft试样I型层间断裂能GIc

    GIc-ini—Initial energy of type I fracture; GIc-prop—Propagation energy of type I fracture

    Figure  11.  Type I interlayer fracture energy GIc of sample FITlft

    图  12  空白组FITlft试样典型的力-位移曲线(a)和R曲线(b)

    Figure  12.  Typical force-displacement curves (a) and R curves (b) for blank and sample FITlft

    表  1  用于对比实验的薄膜材料

    Table  1.   Thin film materials for comparative experiments

    Sample Sizing agent Electrophoretic deposition
    CF Yes None
    CF-1 None None
    Al2O3/CF None Al2O3
    GNPs/CF None GNPs
    GNPs-Al2O3/CF None GNPs/Al2O3
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出版历程
  • 收稿日期:  2023-10-17
  • 修回日期:  2024-01-14
  • 录用日期:  2024-01-29
  • 网络出版日期:  2024-03-02
  • 刊出日期:  2024-08-15

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