A Review of Flexible Thermal Conductive Materials
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摘要: 随着电子器件向着高集成化、高功率化、一体化和多功能化方向发展，以及可穿戴器件、柔性显示和软体机器人等新型柔性器件的兴起，对器件的高效散热和柔性可变形能力提出了更高的要求，因此柔性散热材料得到越来越多的关注，具有广阔的应用前景。本文综述了柔性散热材料的研究进展和现状，对比分析了碳基类、聚合物类和液态金属类这三大类柔性散热材料的优缺点，指出兼具优良导热性、柔韧性的复合柔性散热材料具有深厚发展潜力和实用价值。Abstract: With the development of electronic devices in the direction of high integration, high power and multifunctionality, as well as the rise of new flexible devices such as wearable devices, flexible displays and soft robots, higher requirements have been put forward for the efficient heat dissipation and flexible deformable ability of the devices, so flexible thermal conductive materials have received more and more attention, and have a broad application prospect. This paper summarizes the research progress and current status of flexible thermal conductive materials, compares and analyzes the advantages and disadvantages of the three major types of flexible thermal conductive materials, namely, carbon-based, polymer-based and liquid metal-based, and points out that the composite flexible thermal conductive materials, which are both excellent in thermal conductivity and flexibility, have profound development potential and practical value.
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Key words:
- flexible thermal conductive materials /
- thermal interface materials /
- graphene /
- polymer /
- liquid metal
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图 1 用于个人体温调节的石墨烯基材料:(a)实现均匀有色石墨烯膜的MSAA方法[18]; (b)基于石墨烯纸的剪纸结构可穿戴个人热管理器件[20]; (c) 石墨烯薄膜加热器[19]; (d)共焦显微拉曼光谱测量悬浮单层石墨烯的导热性[11]
Figure 1. Graphene-based materials for personal thermoregulation : (a) The MSAA method to achieve uniform colored graphene film[18]; (b) A paper-cut structured wearable personal thermal management device based on graphene paper[20]; (c) Graphene film heater[19]; (d) Measurement of thermal conductivity of the suspended monolayer graphene by confocal Raman spectroscopy[11]
图 4 掺杂EGaIn的铂催化硅弹性体。(a) 高度变形的LMEE。(比例尺，25 mm)。(b) EGaIn合金在室温下的滴落示意图。(比例尺，10 mm)。(c) LMEE复合材料的示意图。(d)用热风枪加热LMEE和未填充弹性体的交替条带，红外照片时间序列显示LMEE比弹性体更快地散热(图像对应于热源去除后t = 0,5,10和15 s)。(比例尺，25 mm)。[83]
Figure 4. Platinum-catalysed silicone elastomer doped with EGaIn. (a) Highly deformed LMEE. (Scale bar, 25 mm). (b) Schematic illustration of EGaIn alloy droplets at room temperature. (Scale bar, 10 mm). (c) Schematic illustration of LMEE composite material. (d) Alternating strips of LMEE and unfilled elastomer are heated with a heat gun, and the infrared photo sequence shows that LMEE dissipates heat faster than the elastomer (images correspond to t = 0, 5, 10, and 15 s after the heat source is removed). (Scale bar, 25 mm).[83]
表 1 柔性散热材料导热系数对比
Table 1. Comparison of thermal conductivity coefficient of flexible thermal conductive materials
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表 2 部分柔性散热材料综合性能对比
Table 2. Comparison of Comprehensive Performance of Partial Flexible Thermal Conductive Materials
材料名称 导热系数W/(m·K) 力学性能描述 应用场景 柔性石墨烯/纤维素纳米纤维复合膜[34] 164.7 在 1000 次弯曲循环后，柔性石墨烯/纤维素纳米纤维复合膜在轴向和径向的热导率几乎没有变化柔性电子设备热管理 3D杂化碳膜[35] 1428 具有43.9 MPa的高抗拉强度和高达5.17 GPa的弹性模量 柔性电子设备热管理 镀镍碳纳米管[36] 1198.5 抗弯强度高达72.3 MPa 5G电子设备热管理 镀铜的聚甲基丙烯酸甲酯[37] 3.38 在30°C时的存储模量高达 1742 MPa高性能电子设备散热 硼氮化物(BN)纳米片/聚二烯丙基二甲基氯化铵复合膜[55] 200 薄膜的杨氏模量和抗拉强度分别为28.3±10.6 MPa和7±0.4 MPa 柔性电子设备以及可穿戴设备散热 双交联水凝胶基纳米复合材料[57] 3.5 具有高达400%的延伸率 小型集成电子设备散热 铂催化硅弹性体中与EGaIn微滴复合材料[82] 9.8 其应变极限超过600% 软体机器人、可穿戴设备散热
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