高性能铜基复合材料研究进展

王一同; 邹存磊; 李长鸣; 张爽; 赵亚军; 董闯

doi:10.13801/j.cnki.fhclxb.20230523.003

高性能铜基复合材料研究进展

doi: 10.13801/j.cnki.fhclxb.20230523.003

大连交通大学　材料科学与工程学院，大连 116028

基金项目: 国家自然科学基金(52171134；51901033)；辽宁省自然科学基金(2020-BS-207)；大连市科技创新基金应用基础研究(2022JJ12GX039)；大连市优秀青年科技人才项目(2022RY14)

详细信息

通讯作者:
邹存磊，博士，副教授，硕士生导师，研究方向为高性能铜合金及其复合材料　E-mail: clzou@djtu.edu.cn

中图分类号: TG146
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出版历程
- 收稿日期: 2023-03-09
- 修回日期: 2023-05-14
- 录用日期: 2023-05-17
- 网络出版日期: 2023-05-24
- 刊出日期: 2023-10-15

Research progress of high performance copper matrix composites

School of Materials Science and Engineering, Dalian Jiaotong University, Dalian 116028, China

Funds: National Natural Science Foundation of China (52171134; 51901033); Natural Science Foundation of Liaoning Province (2020-BS-207); Dalian Science and Technology Innovation Foundation of Applied Basic Research (2022JJ12GX039); Dalian Outstanding Young Scientific and Technological Talents Project (2022RY14)

摘要

摘要: 铜和铜合金凭借其高导电性、导热性、易加工性和耐腐蚀等特性被广泛应用于电接触材料、电子封装材料、热交换材料等领域，然而铜合金强化过程中强度和电导率、热导率之间此消彼长的矛盾使其发展受限。铜基复合材料可通过强化相提升材料的强度，并且可避免对铜基体产生严重晶格畸变，最大化保证材料的电导率，从而获得优异强阻比的材料，因此铜基复合材料是高性能铜材的一个重要发展方向。本文概述了高性能铜基复合材料的主要制备方法，总结了复合材料增强相及其特点和发展方向。阐述了主要研究进展及其在轨道交通、电工电子、军工方面的应用现状，并对该材料未来的发展方向进行了展望，为高性能铜基复合材料的研究和应用提供参考。
- 铜基复合材料 /
- 增强相 /
- 制备方法 /
- 功能应用 /
- 研究进展
Abstract: Copper and copper alloys are widely used in electrical contact materials, electronic packaging materials, heat exchange materials and other fields because of their high electrical conductivity, thermal conductivity, easy machinability and corrosion resistance. However, the contradiction between strength, electrical conductivity and thermal conductivity in copper alloys limits its development. Copper matrix composites can improve the strength of materials by strengthening phase, avoid serious lattice distortion to copper matrix, and maximize the conductivity of materials, thus obtaining materials with excellent strength-resistance ratio. Therefore, copper matrix composites are an important development direction of high performance copper materials. In this paper, the main preparation methods of high performance copper matrix composites are summarized, and the reinforcing phase of composites, its characteristics and development direction are summarized. The main research progress and its application status in rail transit, electrics and electronics, military industry are described, and the future development direction of this material is prospected, which provides reference for the research and application of high performance copper matrix composites.
- copper matrix composites /
- reinforcement /
- preparing methods /
- function and applications /
- research progress

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图 1 粉末冶金法制备复合材料工艺流程图

Figure 1. Process flow chart of composite materials prepared by powder metallurgy

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图 2 放电等离子烧结装置示意图

Figure 2. Schematic diagram of spark plasma sintering device

DC—Direct current

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图 3 (a) 搅拌铸造示意图；(b) 挤压铸造示意图

Figure 3. (a) Schematic diagram of stirring casting; (b) Schematic diagram of squeeze casting

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图 4 Cu粉 (a) 和氧化石墨烯纳米片 (b) 的FESEM图像^[34]

Figure 4. FESEM images of Cu powder (a) and graphene oxide nanoplatelets (b)^[34]

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图 5 混杂增强机制示意图：(a) 微/纳米颗粒混杂；(b) 摩擦磨损行为

Figure 5. Schematic diagram of hybrid enhancement mechanism: (a) Micro/nano particle hybrid; (b) Friction and wear behavior

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表 1 碳材料增强铜基复合材料的性能对比

Table 1. Performance comparison of carbon reinforced copper matrix composites

Reinforcement	Pretreatment and molding methods	Ω/(%IACS)	R_m/MPa	HV	K₁/(W·m⁻¹·K⁻¹)	Ref.
Carbon	Powder metallurgy	8.2	127	71	—	[14]
Carbon	Hot-press sintering	—	567	89	—	[15]
Carbon	Powder metallurgy	—	354.8	228	—	[16]
Graphene	CVD	120	—	—	130	[17]
Graphene	CVD + deformation	98	595	—	—	[18]
Graphene	Ball mill and SPS	94	—	62.9	—	[6]
Graphene	MLM process and SPS	88	320	178	—	[19]
Carbon nanotubes	Copper facing and SPS	73.0	341.2	110	—	[20]
Carbon nanotubes	Ball mill and SPS	71.0	225	104.5	—	[21]
Carbon nanotubes	MLM and SPS	—	455	—	—	[22]
Single-walled carbon nanotubes	Electrolytic codeposition	141	700	—	385	[23]
Diamond	Composite electroplating	—	—	—	846	[24]
Diamond	Pulse plasma sintering	—	—	—	690	[25]
Carbon fibre	Electrodeposition and vacuum hot pressing	—	586	84	—	[26]
Carbon fibre	Electroplating and vacuum sintering	97.1	—	50.6	—	[27]
Carbon fibre	CVD	—	—	31.6	67	[28]
Notes: Ω—Electrical conductivity; R_m—Tensile strength; HV—Hardness; K₁—Thermal conductivity; SPS—Spark plasma sintering; CVD—Chemical vapor deposition; MLM—Molecular level mixing; IACS—International annealed copper standard.

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表 2 铜基复合材料颗粒增强相参数

Table 2. Particle reinforced phase parameters of copper matrix composites

Reinforcement	K₂/(g·cm⁻³)	ρ/(10⁻⁶ Ω·m)	Melting point/K	K₁/(W·cm⁻¹·K⁻¹)	CTE/(10⁻⁶ K)	E/GPa
Al₂O₃	3.67	＞1012	2 323	1.59	7.92	380
SiC	3.21	0.1	2 700	1	4.4	480
WC	15.63	0.19	2 993	3.2	5.09	669
TiB₂	4.5	0.9	3 498	6.6	8.28	514
TiN	5.21	0.217	2 950	29.1	9.35	350
TiC	4.93	0.6	3 420	1.71	7.6	269
TaC	14.3	0.3~0.4	4 150	0.21	6.46	366
Notes: K₂—Densification; ρ—Resistivity; CTE—Coefficient of thermal expansion; E—Elastic modulus.

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