Influence of interfacial effect on heat conduction behavior of functional composites
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摘要: 界面是复合材料内部连接不同两相的桥梁,极大地影响着复合材料的热学、电学、力学等各项性能。作为复合材料领域中的一个新的分支,导热复合材料近年来因电子电器的高速发展的需求而受到越来越多的关注。然而,研究发现,即使采用了高填料填充方案,复合材料的导热系数也很难达到导热填料的百分之几,其中界面热阻是影响复合材料导热系数提升的关键因素。本文从界面层及界面传热效应的角度出发,分析了复合材料内部界面热阻的产生原因,并从界面的理论研究方法、实验表征手段及影响材料内部热传导行为的界面因素等方面对界面效应在功能复合材料热传导上的影响规律进行了讨论。最后,对界面及界面热传导行为的研究状况进行了总结与展望。Abstract: The interface is a bridge connecting different two phases inside the composite material, which greatly affects the thermal, electrical, mechanical and other properties of the composites. As a new branch in the field of composite materials, thermal conductive composites have attracted more and more attention in recent years due to the rapid development of electronic and electrical appliances. However, it is found that the thermal conductivity of the composites is difficult to reach a few percent of the thermal conductivity of the conductive filler even if the high packing scheme is adopted, and the interfacial thermal resistance is the key factor affecting the improvement of the thermal conductivity of the composites. This paper analyzes the reasons for the thermal resistance of the internal interface inside the composites from the perspective of the interface layer and the heat transfer effect of the interface. In addition, the influence of interface effects on the heat conduction of functional composites was discussed in terms of theoretical research methods, experimental characterization techniques, and interface factors that affect the internal heat conduction behavior of materials. Finally, the development of interface and interfacial heat transfer research were summarized and prospected.
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表 1 改善界面后复合材料热导率的提升效果
Table 1. Enhancement of thermal conductivity of composites after improving interface
Composite Filler loading The ways to improve interface Thermal conductivity/(W·m−1·K−1) Enhancement in thermal conductivity/% Ref. Graphite film/EP − Graft functional group 0.587 42 [56] BN/PC 18.5vol% Increase the effective area for heat conduction 3.09 221.9 [57] Al2O3-PP/POE 2.8vol% Selective localization at the interface 0.44 60 [58] Al2O3@HGO/EP 70wt% HGO coating reinforces the interfacial interaction of Al2O3 in EP 1.38 72.5 [59] GO/EP 0.5wt% Graft functional group 0.624 117 [60] BN/XSBR 47.4wt% Graft functional group 0.54 18.6 [61] Microdiamond/PLA 60vol% Octadecylamine (ODA) coating on the microdiamond particles improves the interface compatibility between the filler and the matrix 1.66 102.4 [62] Ag-MXene/EP 0.12vol%
(MXene)MXene bridges the isolated Ag particles to further complete the thermal conductive network 72.7 24.7 [63] Notes: EP—Epoxy; PC—Polycarbonate; PP—Polypropylene; POE—Polyolefin elastomer; HGO—Hybrid graphene oxide; GO—Graphene oxide; XSBR—Carboxylated styrene-butadiene rubber; PLA—Poly lactic acid. -
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