陶瓷基复合材料构件内嵌孔加工工艺研究进展

罗潇; 刘小冲; 曾雨琪; 李坚; 徐友良; 李龙彪

doi:10.13801/j.cnki.fhclxb.20240321.001

陶瓷基复合材料构件内嵌孔加工工艺研究进展

doi: 10.13801/j.cnki.fhclxb.20240321.001

1.
中国航发湖南动力机械研究所，株洲 412000
2.
西北工业大学　材料学院，西安 710072
3.
南京航空航天大学　民航学院，南京 211106

基金项目: 中国航发自主创新专项资金(ZZCX-2017-016)

详细信息

通讯作者:
刘小冲，博士，副研究员，研究方向为陶瓷基复合材料设计、制备、性能表征及材料结构健康监测　E-mail: liuchong@nwpu.edu.cn

中图分类号: TB332
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- HTML全文浏览量: 85
- PDF下载量: 24
- 被引次数: 0
出版历程
- 收稿日期: 2023-12-04
- 修回日期: 2024-02-14
- 录用日期: 2024-02-26
- 网络出版日期: 2024-03-21
- 刊出日期: 2024-08-15

Research progress on machining process of embedded holes in hot-section ceramic-matrix composite components

1.
Hunan Aviation Powerplant Research Institute, Aero Engine Corporation of China, Zhuzhou 412000, China
2.
School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China
3.
College of Civil Aviation, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, China

Funds: Independent Innovation Special Fund Project of Aero Engine Corporation of China (ZZCX-2017-016)

摘要

摘要: 陶瓷基复合材料是一种典型的难加工材料，除了各向异性的特点外，其硬度仅次于金刚石和立方氮化硼。航空发动机热端部件内嵌孔(气膜孔等)是陶瓷基复合材料部件的基本结构，对陶瓷基复合材料构件制备成型和服役性能的发挥具有重要意义。本文给出了陶瓷基复合材料热端部件内嵌孔的分类及用于加工陶瓷基复合材料内嵌孔的方法，包括常规机械加工方法、超声振动辅助加工方法、激光加工方法等，阐述了上述加工方法的加工原理、工艺特征、工艺参数的选取及加工缺陷特征、形成机制等，给出了不同直径、深径比陶瓷基复合材料内嵌孔加工工艺的建议。
- 陶瓷基复合材料 /
- 内嵌孔 /
- 加工方法 /
- 机械加工 /
- 超声振动辅助加工 /
- 激光加工
Abstract: Ceramic-matrix composites (CMCs) are typical difficult-to-machine materials, which possess great hardness—second only to diamond and cubic boron nitride—and anisotropy. The fundamental structure of CMCs parts in aeroengines is the embedded holes (air film holes, etc.) in the hot-section components. These holes are crucial for the preparation and molding of CMCs components as well as the service life. The categorization of embedded holes in hot-section CMCs components is given in this paper. The processing principles, process characteristics, selection of process parameters, characteristics of the processing defects and formation mechanism, etc., are all determined by analyzing the methods used for processing CMCs embedded holes, including conventional mechanical processing methods, ultrasonic vibration-assisted processing methods, laser processing methods, etc. Recommendations for the processing of CMCs embedded holes with different diameters and depth-to-diameter ratios are also provided.
- ceramic-matrix composites (CMCs) /
- embedded holes /
- processing methods /
- mechanical processing /
- ultrasonic vibration-assisted processing /
- laser processing

HTML全文

图 1 美国通用电气公司(GE)首次实现陶瓷基复合材料(CMCs)转子叶片地面试验

Figure 1. Ground test of ceramic-matrix composites (CMCs) blade in Generalelectric (GE) company

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图 2 CFM公司LEAP发动机和CMCs涡轮外环应用情况

Figure 2. CMCs turbine shroud in LEAP engine developed by CFM company

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图 3 GE9 X发动机采用SiC/SiC部件示意图

Figure 3. Schematic diagram of GE9 X engine with SiC/SiC components

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图 4 SiC/SiC整体涡轮叶盘试飞情况

Figure 4. Flight tests of SiC/SiC turbine blisk

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图 5 (a)某CMCs火焰筒部件热管理微孔；(b) CMCs加工出的直通和异形热管理孔

Figure 5. (a) Thermal management micro holes of a CMCs flame component; (b) Through and shaped thermal management holes machined from CMCs

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图 6 三维针刺(a)、二维叠层(b)、2.5维编织(c)、三维编织(d) C/SiC复合材料纤维预制体结构^[21]

Figure 6. 3D needled-punch (a), two-dimensional lamination (b), 2.5-dimensional woven (c), three-dimensional (d) braided fiber architectures in C/SiC composites^[21]

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图 7 (a)沿轴向纤维磨削；(b)沿横向纤维磨削；(c)沿法向纤维磨削^[24]

Figure 7. Grinding schematic diagram in fiber longitudinal direction (a), transverse direction (b) and normal direction (c)^[24]

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图 8 单颗粒切割纤维束的3种模式：(a)轴向；(b)横向；(c)法向^[26]

Figure 8. Three modes of the single-grain cutting into a fiber bundle: (a) Longitudinal; (b) Transverse; (c) Normal^[26]

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图 9 平底金刚石(a)和锋利金刚石(b)磨粒划擦2.5维SiC/SiC复合材料表面形貌^[28]

Figure 9. Topographies of 2.5D SiC/SiC composite after scribing by flat grit (a) and sharp grit (b)^[28]

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图 10 CMCs不同部位处钻头所受径向力示意图^[39]

Figure 10. Diagram representing radial stress changes with the position in CMCs^[39]

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图 11 C/SiC复合材料钻孔和螺旋铣孔的出入口质量：(a)钻削入口；(b)钻削出口；(c)螺旋铣削出口^[40]

Figure 11. Hole quality under helical milling and drilling of C/SiC composite: (a) Drilling cut-in; (b) Drilling cut-out; (c) Helical milling cut-out^[40]

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图 12 C/SiC内嵌孔的加工照

Figure 12. Processing photos of C/SiC embedded holes

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图 13 不同刀具制孔获得的三维表面粗糙度S_a均值

1—Diamond-coated cutting tools; 2—Electroplated superhard abrasive cutting tools; 3—Brazed diamond cutting tools; 4—Multiple cutting PCD tools

Figure 13. Mean values of three-dimensional surface roughness S_a obtained by different tools for hole making

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图 14 液氮辅助低温加工系统^[41]

Figure 14. Liquid nitrogen assisted cryogenic processing system^[41]

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图 15 液氮辅助加工C/SiC复合材料的效果：(a)刀具温度；(b)切削力^[41]

Figure 15. Effectiveness of liquid nitrogen-assisted machining of C/SiC composites: (a) Cutting tool temperature; (b) Cutting force^[41]

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图 16 超声振动辅助铣削过程中切削力示意图^[42]

Figure 16. Schematic diagram of cutting force during ultrasonic vibration-assisted milling process^[42]

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图 17 传统钻孔(a)及旋转超声波加工(b)的C/SiC表面形貌^[44]

Figure 17. C/SiC surface morphology of conventional drilling (a) and rotary ultrasonic machining (b)^[44]

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图 18 飞秒激光加工SiC/SiC复合材料机制^[55]

Figure 18. Femtosecond laser processing mechanism of SiC/SiC composites^[55]

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图 19 SiC/SiC叶片激光加工工艺示意图

Figure 19. Schematic diagram of laser machining process of SiC/SiC blade

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图 20 水导激光加工原理示意图^[56]

Figure 20. Basic principle of the water jet-guided laser technology^[56]

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图 21 水导激光加工SiC/SiC复合材料圆孔形貌^[57]

Figure 21. Circular hole morphology of SiC/SiC composite under water-guided laser processing^[57]

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