RTM工艺中树脂固化温度与介电性能

宋修宫, 王继辉, 高国强

宋修宫, 王继辉, 高国强. RTM工艺中树脂固化温度与介电性能[J]. 复合材料学报, 2007, 24(1): 18-21.
引用本文: 宋修宫, 王继辉, 高国强. RTM工艺中树脂固化温度与介电性能[J]. 复合材料学报, 2007, 24(1): 18-21.
SONG Xiugong, WANG Jihui, GAO Guoqiang. Temperature and dielectric property of resin during RTM process[J]. Acta Materiae Compositae Sinica, 2007, 24(1): 18-21.
Citation: SONG Xiugong, WANG Jihui, GAO Guoqiang. Temperature and dielectric property of resin during RTM process[J]. Acta Materiae Compositae Sinica, 2007, 24(1): 18-21.

RTM工艺中树脂固化温度与介电性能

基金项目: 国家863项目(2001AA335020)
详细信息
    通讯作者:

    王继辉, 教授, 主要从事聚合物基复合材料研究 E-mail: jhwang@mail.whut.edu.cn

  • 中图分类号: TB332

Temperature and dielectric property of resin during RTM process

More Information
    Corresponding author:

    WANG Jihui: SONG Xiugong

  • 摘要: RTM为闭模成型工艺, 难以观察到模腔内树脂的充模与固化反应过程。利用介电分析仪对RTM工艺进行在线监测, 测得了树脂固化过程中不同模具温度下树脂反应的温度及离子导电率、 不同纤维含量条件下的介电常数以及不同纤维织物方式下的离子导电率。实验结果表明: 固化反应放热使复合材料局部温度升高, 并形成复杂的温度梯度分布; 在较高温度和较低纤维含量条件下, 离子导电率变化较快, 对树脂固化反应的影响较大; 不同织物方式的玻璃纤维对离子导电率也有一定的影响, 玻璃纤维复合毡比方格布影响大。
    Abstract: As a close-mold process, it is difficult to observe the mold filling and chemical reaction procedure in the RTM process. In this study, the reaction information in the mould was obtained using the dielectric analyzer for on-line monitoring. The resin reaction temperature and ionic conductivity under different mold temperatures were investigated. The influence of the fabric volume fraction on the composite permittivity was studied. And the ionic conductivity during the curing process was studied for different fabrics. The results show that the exothermic reaction increases the local temperature in the composite and a complex temperature gradient distribution was formed. In the case of high temperature and low fabric volume fraction, the ionic conductivity changes dramatically, which in turn has a significant influence on the resin curing process. The fabric type also affects the ionic conductivity, with a higher value for random mat reinforced composites than that of woven fabrics.
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出版历程
  • 收稿日期:  2006-03-05
  • 修回日期:  2006-06-11
  • 刊出日期:  2007-02-14

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