大功率磁器件用软磁复合材料的现状与发展趋势

Present situation and development trend of soft magnetic composites for high-power magnetic devices

  • 摘要: 第三代功率半导体的迭代升级对大功率磁器件用软磁复合材料提出了高频、低损耗、高直流偏置的严苛性能要求。近年来,业界和学术界在优化该类材料的直流偏置性能与功率损耗方面已取得显著成果,但其综合电磁性能仍急需进一步提升。本文围绕磁导率、直流偏置特性、高频损耗等核心性能指标,系统梳理了软磁复合材料在绝缘包覆、粉末级配、压制成型及热处理关键工艺中的技术瓶颈与国内外最新研究进展,整合了相关领域及作者团队的研究成果,深入剖析了性能优化的可行路径。此外,本文还对行业未来发展的挑战与机遇进行了展望,以期为大功率磁器件用软磁复合材料的研发与应用提供参考。

     

    Abstract: The continuous upgrading of third-generation power semiconductors has imposed stringent requirements on soft magnetic composites (SMCs) for high-power magnetic devices, including superior high-frequency performance, low power loss, and excellent DC-bias characteristics. In recent years, notable advances have been achieved in industry and academia, regarding the optimization of DC-bias performance and power loss of SMCs for high-power magnetic applications. However, the comprehensive electromagnetic properties of SMCs remain in urgent need of further enhancement. Focusing on key performance indicators, i.e., permeability, DC-bias characteristics, and high-frequency loss, this review systematically summarizes the technical bottlenecks and latest research progress of SMCs for high-power magnetic devices in crucial processes, including insulation coating, powder mixing, formation, and heat treatment. It incorporates global research advances in related fields alongside our team’s findings, while conducting an in-depth analysis of feasible performance optimization pathways. In addition, this work discusses the future challenges and opportunities confronting the SMC industry for high-power magnetic devices, aiming to provide a reference for the research, development, and application of such materials.

     

/

返回文章
返回