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相变微胶囊的壳材导热改性研究及其在调温领域中的应用

孟凡璠 李晓鹏 赵越 李增和 张守鑫 李和国

孟凡璠, 李晓鹏, 赵越, 等. 相变微胶囊的壳材导热改性研究及其在调温领域中的应用[J]. 复合材料学报, 2024, 43(0): 1-20.
引用本文: 孟凡璠, 李晓鹏, 赵越, 等. 相变微胶囊的壳材导热改性研究及其在调温领域中的应用[J]. 复合材料学报, 2024, 43(0): 1-20.
MENG Fanfan, LI Xiaopeng, ZHAO Yue, et al. Research on thermal conductivity modification of phase change microcapsules and its application in thermoregulation field[J]. Acta Materiae Compositae Sinica.
Citation: MENG Fanfan, LI Xiaopeng, ZHAO Yue, et al. Research on thermal conductivity modification of phase change microcapsules and its application in thermoregulation field[J]. Acta Materiae Compositae Sinica.

相变微胶囊的壳材导热改性研究及其在调温领域中的应用

详细信息
    通讯作者:

    李增和,博士,教授,博士生导师,研究方向为标准物质 E-mail: lizh@mail.buct.edu.cn

    张守鑫,硕士,助理研究员,研究方向为化学防护 E-mail: zhangsxfhyjy@163.com

    李和国,博士,研究员,博士生导师,研究方向为化学防护 E-mail: liheguo1972@126.com

  • 中图分类号: TKO2;TS1;TB332

Research on thermal conductivity modification of phase change microcapsules and its application in thermoregulation field

  • 摘要: 相变微胶囊(microcapsule phase change materials,MPCM)是通过微胶囊化技术将相变材料包裹制备而成的,能够储存或释放大量热能,在许多领域具有良好的应用前景。但MPCM在实际应用中仍存在导热性能较差等问题,严重限制了其应用,因此越来越多的微胶囊导热改性方法被研究,用于制备导热性能增强的MPCM。本文通过阐述Pickering乳液、表面接枝、化学镀层和物理掺杂等改性方法的原理与特点,总结了微胶囊壳材导热改性方法,并概述了微胶囊在调温领域的相关进展。最后,展望了MPCM壳材导热改性的研究方向以及其在调温领域的未来前景与挑战。

     

  • 图  1  微胶囊壳材导热改性的研究方法及在调温领域的应用示意图

    Figure  1.  Schematic of the research method of thermal conductivity modification of microencapsulated shells and its application in the fields of thermoregulation

    图  2  微胶囊壳材导热改性的研究趋势(检索方式: Web of Science; 检索关键词: Phase change microcapsules、Shell thermal conductivity; 关键词检索范围: 标题、摘要和关键词;检索时间:2015-2023)

    Figure  2.  Research trends in thermal conductivity modification of microcapsule phase change materials shells (Search method: Web of Science; Search terms: Phase change microcapsules, Shell thermal conductivity; Keyword search scope: Title, Abstract, and Keywords; Search date: 2015-2023)

    图  3  (a)传统乳液和(b)Pickering乳液的对比图

    Figure  3.  Comparison of (a) Conventional Emulsion and (b) Pickering Emulsion

    图  4  (a) GNPs导热微胶囊的制备原理(b) GNPs导热微胶囊SEM图(c)不同含量GNPs微胶囊的导热率[52];(d) CuS/MF壳材微胶囊的制备原理(e) CuS/MF壳材微胶囊SEM图(f) CuS、MF和不同含量CuS微胶囊导热率[54];(g) BN-TiO2/PMMA壳材微胶囊的制备原理(h) BN-TiO2/PMMA壳材微胶囊SEM图(i)石蜡和不同含量BN-TiO2微胶囊的导热率[55]

    Figure  4.  (a) Preparation principle of GNPs thermally conductive microcapsules (b) SEM of GNPs thermally conductive microcapsules (c) Thermal conductivity of microcapsules with different contents of GNPs [52]; (d) Preparation principle of CuS/MF microcapsules (e) SEM of CuS/MF microcapsules (f) Thermal conductivity of CuS, MF and different contents of CuS microcapsules [54]; (g) Preparation principle of BN-TiO2/PMMA microcapsules (h) SEM of BN-TiO2/PMMA microcapsules (i) Thermal conductivity of paraffin wax and different contents of BN-TiO2 microcapsules [55]

    图  5  (a)不同类型的Janus纳米粒子结构;(b) Ag Janus/PDVB壳材微胶囊合成机制(1)为用 Ag Janus稳定的石蜡/水乳液(2)为通过聚合形成壳材后的微胶囊(c)哑铃状含Ag的Janus纳米粒子(d) Ag Janus/PDVB壳材微胶囊SEM图(e)微胶囊破损壳层SEM图[60]

    Figure  5.  (a) Structures of different types of Janus nanoparticles; (b) Synthesis mechanism of Ag Janus/PDVB shell material microcapsules (1) for paraffin/water emulsion stabilized with Ag-Janus (2) for microcapsules after shell material formation by polymerization (c) Dumbbell shaped Ag-containing Janus nanoparticles (d) SEM of Ag Janus/PDVB shell material microcapsules (e) SEM of broken shell layer of the microcapsules [60]

    图  6  (a)TiO2/PDVB壳材微胶囊制备原理(b)KH570 对纳米TiO2粒子接枝改性机制[44]

    Figure  6.  (a) Principle of TiO2/PDVB microcapsules preparation (b) Mechanism of grafting modification of TiO2 nanoparticles by KH570 [44]

    图  7  (a) PMMA-PDA-Ag /壳材微胶囊制备原理(b) PMMA-PDA-Ag壳材微胶囊SEM图(c)添加不同AgNO3浓度制得微胶囊的导热率[65]

    Figure  7.  (a) Principle of PMMA-PDA-Ag microcapsules preparation (b) SEM of PMMA-PDA-Ag microcapsules (c) Thermal conductivity of microcapsules prepared by adding different AgNO3 concentrations [65]

    图  8  Al2O3、ZnO、CNTs改性MMF壳材微胶囊制备原理[73]

    Figure  8.  Principles of microcapsule preparation for Al2O3, ZnO and CNTs modified MMF shell [73]

    图  9  (a) MF-PSS/CNTs壳材微胶囊制备原理(b) MF-PSS/CNTs壳材微胶囊SEM图[76];(c) SiO2-TiC/PMMA壳材微胶囊制备原理(d)SiO2-TiC/PMMA壳材微胶囊SEM图[48]

    Figure  9.  (a) Principle of MF-PSS/CNTs microcapsules preparation (b) SEM of MF-PSS/CNTs microcapsules [76]; (c) Principle of SiO2-TiC/PMMA microcapsules preparation (d) SEM of SiO2-TiC/PMMA microcapsules [48].

    图  10  TiO2壳材微胶囊制备原理(a)传统球形微胶囊(b)石榴状微胶囊(c、d)传统球形微胶囊SEM图(e、f)石榴状微胶囊SEM图[77]

    Figure  10.  Principle of TiO2 microcapsule preparation (a) Conventional spherical microcapsule (b) Pomegranate microcapsule (c, d) SEM of conventional spherical microcapsule (e, f) SEM of pomegranate microcapsule [77]

    图  11  (a)手机CPU实物图(b)贴附微胶囊聚氨酯薄膜的手机CPU红外成像图(c)温度变化曲线图[52]

    Figure  11.  (a) Physical image of a mobile phone CPU (b) Infrared imaging of a mobile phone CPU with microencapsulated polyurethane film attached (c) Temperature variation graph [52]

    图  12  (a)电子器件散热器组件的示意图[82](b)含石蜡@BN/PS微胶囊的LED热管理测试的设备示意图[50]

    Figure  12.  (a) Schematic diagram of heat sink assembly for electronics [82] (b) Schematic diagram of equipment for thermal management testing of LEDs containing paraffin @ BN/PS microcapsules [50]

    图  13  (a)(I)房间微腔模型示意图 (II)红外成像测试(b)RPUF、RPUF-MPCM、RPUF- CNTs MPCM和 RPUF- LDH/CNTs MPCM在(I)升温过程(II)降温过程中的红外热成像测试(c)RPUF、RPUF-MPCM、RPUF- CNTs MPCM和 RPUF- LDH/CNTs MPCM的(a、c、e)第1次、第50次、第100次壁温和(b、d、f) 第1次、第50次、第100次内部中心温度曲线[84]Fig.13 (a) Schematic diagram of (I) room microcavity model (II) IR imaging test (b) IR thermography test of RPUF、RPUF-MPCM、RPUF- CNTs MPCM和 RPUF- LDH/CNTs MPCM during (I) warming up (II) cooling down (c) IR thermography test of RPUF、RPUF-MPCM、RPUF- CNTs MPCM和 RPUF- LDH/CNTs MPCM for (a, c, e) 1 st, 50 th, 100 th wall temperature and (b, d, f) 1 st, 50 th, 100 th internal centre temperature[84]

    图  14  (a)房间微腔模型示意图(b)红外成像测试装置(c)热量传递示意图(d)墙壁温度变化曲线[86]

    Figure  14.  (a) Schematic of the room microcavity model (b) Infrared imaging test setup (c) Schematic of the heat transfer (d) Wall temperature change profile [86]

    图  15  (a)光热转换实验装置示意图(b)不同SiC含量微胶囊的光热转换曲线(c)不同SiC含量微胶囊的能量图和光热转换效率图(d)光热转换原理图[94]

    Figure  15.  (a) Schematic diagram of the experimental setup for photothermal conversion (b) Photothermal conversion curves of microcapsules with different SiC contents (c) Energy diagrams and photothermal conversion efficiencies of microcapsules with different SiC contents (d) Schematic diagram of photothermal conversion [94]

    表  1  相变微胶囊(MPCM)常见芯材物质及其特点

    Table  1.   Common microcapsule phase change materials (MPCM) and their characteristics

    CategorizationPhase change materialsCharacteristics
    Organic compoundHydrocarbons[9]: n-hexadecane, n-octadecane, liquid paraffinsAdvantages: good stability, less corrosive, no supercooling and phase separation, higher latent heat of phase transition, wider range of phase transition temperature
    Disadvantages: low thermal conductivity, easy to volatilize, easy to burn
    Alcohols, esters[10, 11]: tetradecanol, cyclohexanol, butyl stearate
    Fatty acids[12]: lauric, capric, caprylic, dodecanoic acids
    Inorganic compound[13]Metal alloys, crystalline water and salts, molten saltsAdvantages: higher latent heat of phase change, higher thermal conductivity, lower cost
    Disadvantages: susceptible to subcooling and phase separation, a certain degree of corrosiveness
    下载: 导出CSV

    表  2  MPCM常见壳材物质及其特点

    Table  2.   Common shell materials and their characteristics

    Categorization Shell materials Characteristics
    Organic polymer materials[14] Natural polymers: gelatin, gum arabic, pectin, chitosan, cellulose acetate, carboxymethyl cellulose, sodium carboxymethyl cellulose Advantages: denseness, chemical stability and flexibility, relatively simple preparation process, etc., of which natural polymer materials have good biodegradability, non-toxic, good film-forming properties
    Disadvantages: low thermal conductivity, will delay the thermal response, while flammable and low mechanical strength
    Synthetic polymers: PU, PMMA, melamine formaldehyde resin (MF), urea formaldehyde resin (UF), polystyrene (PS), polydiethylbenzene (PDVB)
    Inorganic materials[4, 15] SiO2、TiO2、CaCO3、Al、Cu、GN、GO、Copper Silicate, Clay, Sulfide Advantages: not easy to burn, thermal conductivity is usually higher, mechanical strength is also higher, and has a variety of functions, safety and environmental protection
    Disadvantages: poor durability, poor flexibility, complex preparation process
    Notes:PU is polyurea; PMMA is polymethyl methacrylate; GN is graphene nanosheet; GO is graphene oxide.
    下载: 导出CSV

    表  3  MPCM壳材导热改性方法总结

    Table  3.   Summary of phase change microencapsulation shell modification methods

    Phase change materials Shell materials Thermal conductive materials Thermal conductivity/
    M(W·(m·K)−1)
    Enhancement effect Preparation method Characteristics Reference
    Paraffin MF Chitin nanocrystals 0.34 204.6% Pickering emulsion Simple method, green, thermal conductive materials are evenly distributed in the shell layer.
    There is a problem of thermal conductive materials falling off.
    [6]
    Stearic acid Ag Ag 1.18 333.8% [23]
    Paraffin GN GN 0.71 35.4% [24]
    Paraffin PU GO 0.34 - [25]
    Paraffin GO/GN GO/GN 0.90 260.0% [26]
    Paraffin MF Nanodiamond 0.78 49.2% [27]
    N-octadecane PMMA TiO2 0.30 88.1% [28]
    Mg(NO3)2 SiO2 SiO2 1.40 700% [29]
    Paraffin MUF ZrC 0.49 225.2% Surface
    grafting
    Thermal conductive materials are connected to the shell materials through chemical bonds, which are more firm and less likely to fall off.
    The method of modifying thermally conductive materials is complex and varied.
    [30]
    Paraffin SiO2 Modified GO 1.60 700% [31]
    N-octadecane / N-octacosane MF Octadecyl isocyanate grafted CNTs 0.33 71.4% [32]
    N-octadecane MF Octadecylamine grafted GO 0.26 38.52% [33]
    Capric PMMA Ammonium polyphosphate-modified halloysite nanotubes 0.36 88.6% [34]
    Capric PMMA Modified halloysite nanotubes - - [35]
    Paraffin MUF Cu - - Chemical plating Good thermal stability, high coating rate, uniform and firm distribution of thermal conductive materials on the shell materials. [36]
    Paraffin SiO2 Ag 0.80 42.62% [37]
    Paraffin SiO2 Ag/Pt - - [38]
    Paraffin SiO2 GN - 42.8% [39]
    N-octadecane Styrene-divinylbenzene copolymer Ti3C2 MXene 0.29 52.3% Physical doping The method is simple and easy to operate.
    The shell layer is not stable in wrapping the thermal conductive materials, and the thermal conductive materials are not uniformly distributed.
    [40]
    N-hexadecane PDVB Cu 0.51 319.5% [41]
    Notes:MF is melamine formaldehyde resin; GN is graphene nanosheet; PU is polyurea; GO is graphene oxide; PMMA is polymethyl methacrylate; MUF is melamine urea formaldehyde; PDVB is polydiethylbenzene.
    下载: 导出CSV
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  • 收稿日期:  2024-08-29
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