Laser processing of small holes with large aspect ratio in SiCf/SiC composites
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摘要: SiCf/SiC陶瓷基复合材料(SiCf/SiC复合材料)具有各向异性、高硬度和低导电性等特点，导致其大深径比小孔难以加工。飞秒激光加工和水导激光加工属于先进激光加工方法，具有加工质量可控、自动化加工、加工成本低等优势，是解决SiCf/SiC复合材料大深径比小孔的优选技术方案。采用了飞秒激光旋切制孔和水导激光制孔方法，在3 mm厚SiCf/SiC复合材料上加工出深径比为10的小孔。分析了小孔入口、出口、孔壁的形貌及物相，对比了小孔的孔径、孔壁粗糙度及加工效率。结果表明，激光加工的孔出口质量均优于入口质量，飞秒激光加工的小孔具有孔口锋利、圆度好、锥度小等优点，水导激光加工具有孔口光滑清洁、孔壁光洁、加工效率高等优点。针对SiCf/SiC陶瓷基复合材料耐热构件大深径比小孔加工需求，应综合考虑加工质量、加工效率、加工工况等因素，选择合适的制孔技术。Abstract: The processing of small holes with large aspect ratio in SiCf/SiC ceramic matrix composites (SiCf/SiC composites) are characterized by anisotropy, high hardness, and low electrical conductivity, which makes it difficult. Femtosecond laser processing and water-guided laser processing belong to the advanced laser processing methods, which have the advantages of controllable processing quality, automated processing, and low processing cost, and are the preferred technological solutions to solve the large aspect ratio of small holes in SiCf/SiC composites. Small holes with an aspect ratio of 10 are processed in SiCf/SiC composites by using femtosecond laser rotary drilling (FLRD) and water jet guided laser drilling (WJGLD). The morphology and physical phases of the entrance, exit, and wall of the small holes were analyzed, and the hole diameter, hole wall roughness, and processing efficiency of the small holes were compared. The results show that the exit quality of the holes processed by laser is better than the entrance quality, and the small holes processed by femtosecond laser have the advantages of sharp orifice, good roundness, and small taper, while the water guide laser processing has the advantages of clean orifices and hole walls, and high processing efficiency. To address the demand for small holes with large aspect ratios in heat-resistant components of SiCf/SiC composites, suitable drilling technology should be selected by considering factors such as processing quality, processing efficiency, and processing conditions.
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图 1 激光加工系统的示意图: (a) 飞秒激光; (b) 水导激光
Figure 1. Schematic diagram of laser processing system: (a) Femtosecond laser; (b) Water jet guided laser
图 2 SiCf/SiC复合材料样件及形貌: (a)样件; (b)CT图; (c)截面
Figure 2. Samples and morphology of SiCf/SiC composites: (a) Sample;(b) CT image; (c) Cross-section
图 3 飞秒激光旋切制孔示意图: (a)钻孔; (b)修孔
Figure 3. Schematic diagram of femtosecond laser rotary drilling: (a) Drilling; (b) Finishing
图 5 SiCf/SiC复合材料孔入口沉积物的拉曼光谱
Figure 5. Raman spectra of hole entrance deposits of SiCf/SiC composites
图 8 SiCf/SiC复合材料孔壁的形貌: (a) 孔入口区域; (b) 孔中间区域; (c) 孔出口区域
Figure 8. Morphology of the hole wall of SiCf/SiC composites: (a) Hole entrance region; (b) Hole middle region; (c) Hole exit region
图 9 SiCf/SiC复合材料孔壁纤维区的形貌: (a) 90°纤维区; (b) 0°纤维区
Figure 9. Morphology of the fiber region in the hole wall of SiCf/SiC composites: (a) 90° fiber region; (b) 0° fiber region
图 10 SiCf/SiC复合材料孔截面纤维区的形貌
Figure 10. Morphology of fiber region in the hole cross section of SiCf/SiC composites
图 11 水导激光制孔示意图: (a) 盲孔阶段; (b) 通孔阶段
Figure 11. Schematic diagram of WJGLD: (a) Blind hole stage;(b) Through-hole stage
图 15 SiCf/SiC复合材料孔壁90°纤维区的形貌
Figure 15. Morphology of the 90° fiber region in the hole wall of SiCf/SiC composites
图 16 SiCf/SiC复合材料孔壁0°纤维区的形貌
Figure 16. Morphology of the 0° fiber region in the hole wall of SiCf/SiC composites
图 17 SiCf/SiC复合材料孔截面纤维区和基体区的形貌
Figure 17. Morphology of the fiber and matrix regions in the hole cross section of SiCf/SiC composites
图 18 SiCf/SiC复合材料孔的入口和出口形貌: (a) FLRD的形貌; (b) WJGLD的形貌
Figure 18. Entrance and exit morphology of SiCf/SiC composites holes: (a) Morphology of FLRD; (b) Morphology of WJGLD
图 19 SiCf/SiC复合材料孔的入口和出口直径
Figure 19. Entrance and exit diameters of SiCf/SiC composites holes
图 20 SiCf/SiC复合材料孔孔的锥度和出口圆度误差
Figure 20. Taper and exit roundness error of SiCf/SiC composites holes
图 21 SiCf/SiC复合材料孔的轮廓：(a) FLRD的轮廓; (b) WJGLD的轮廓
Figure 21. Profile of SiCf/SiC composites holes: (a) Hole profile of FLRD,(b) Hole profile of WJGLD
表 1 飞秒激光旋切制孔参数
Table 1. Femtosecond laser rotary drilling parameters
Parameters Drilling Finishing DL/μm 200 300 P/W 8 6 f /kHz 50 50 F/(mm·min−1) 15 5 ap/μm 60 \ Note: DL is the diameter of laser knife, P is the laser power, f is the frequency, F is the feed speed, ap is the pith of helical path. 
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表 2 水导激光制孔参数
Table 2. Parameters of WJGLD
Parameters Value Dw/μm 50 p/MPa 10 P/W 17 f /kHz 6 F/(mm·min−1) 3 Notes：Dw is the diameter of the WJGL, p is the chamber pressure, P is the laser power, f is the frequency, F is the feed speed.
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