墨水直写技术制造纤维强韧陶瓷基复合材料的研究进展与挑战

陈晓旖; 李刘颂; 郭欢; 李兴泽; 代吉祥; 沙建军

墨水直写技术制造纤维强韧陶瓷基复合材料的研究进展与挑战

陈晓旖¹,
李刘颂¹,
郭欢¹,
李兴泽¹,
代吉祥^1, ,,
沙建军^{1, 2}

1.
大连理工大学　力学与航空航天学院, 大连 116024
2.
工业装备结构分析优化与CAE软件全国重点实验室, 大连 116024

基金项目: 辽宁省自然科学基金(2023MS094)；陕西省航天复合材料重点实验室开放基金(ZX20220525)

详细信息

通讯作者:
代吉祥，博士，副教授，硕士生导师，研究方向为陶瓷基复合材料　E-mail: jxdai@dlut.edu.cn

中图分类号: TQ174; TB332
计量
- 文章访问数: 61
- HTML全文浏览量: 82
- 被引次数: 0
出版历程
- 收稿日期: 2024-04-19
- 修回日期: 2024-05-17
- 录用日期: 2024-06-03
- 网络出版日期: 2024-06-25

Research progress and challenges in manufacturing fiber reinforced ceramic matrix composites using direct ink writing technology

1.
School of Mechanics and Aerospace, Dalian University of Technology, Dalian 116024, China
2.
National Key Laboratory of Structural Analysis and Optimization of Industrial Equipment and CAE Software, Dalian 116024, China

Funds: Liaoning Provincial Natural Science Foundation (2023MS094); Open Funding Project of Shaanxi Key Laboratory of Aerospace Composite (ZX20220525)

摘要

摘要: 先进陶瓷及其复合材料凭借优异的性能已被广泛应用于航空航天领域，目前采用三维打印技术实现这类材料的快速低成本制备成为核心问题。与传统工艺相比，现有三维打印陶瓷材料普遍面临着脆性特征明显及损伤容限能低的问题，因此纤维复合陶瓷材料的三维打印技术成为研究热点。综述了近年来国内外基于墨水直写技术制备纤维强韧陶瓷基复合材料的技术路线及特点，围绕这类材料的组成成分、工艺路径与力学性能的关系，综合分析了不同陶瓷墨水的设计、纤维引入的方式、致密化工艺的选择、打印构件关键性能之间的有机联系，指出了当前的主要问题并对未来研究方向进行了展望。
- 增材制造 /
- 墨水直写成型 /
- 陶瓷基复合材料 /
- 航空航天
Abstract: Advanced ceramics and composites have been widely used in aerospace applications because of their excellent performance, at present, the use of three-dimensional (3D) printing technology to achieve rapid, efficient, and low-cost preparation of such materials has become a central issue. Compared with the traditional process, the 3D printing of ceramic materials is generally faced with the problem of their inherent brittleness and low damage tolerance. Therefore, the incorporation of fiber reinforcements in printed parts to overcome the challenges of poor fracture toughness of advanced ceramics has become a hot topics and frontier. Here, we systematically summarize recently developed direct ink writing (DIW) technologies for printing fiber reinforced ceramic matrix composites (FRCMC), focus on the relationship between the processing, structure, and properties of DIW-FRCMCs, comprehensively analyze the ceramic ink design process, the fiber introduction method, the densification technologies and the important properties of the printed parts. In the last, the important issues were pointed out and future research directions were prospected.
- additive manufacturing /
- ink direct writing molding /
- ceramic matrix composites /
- aerospace

HTML全文

图 1 先进陶瓷及其复合材料三维打印工艺及断裂韧性

Figure 1. 3 D printing process and fracture toughness of advanced ceramics and their composite materials

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图 2 近五年公开发表的墨水直写 (DIW)工艺制造纤维强韧陶瓷基复合材料(DIW-FRCMC)的文献数量及其应用领域

Figure 2. Number of publicly published literature on direct ink writing (DIW) technologies for printing fiber reinforced ceramic matrix composites (DIW-FRCMC) in the past five years and their application areas

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图 3 通过DIW工艺制备的先进陶瓷零部件^[27-28]

Figure 3. Advanced ceramic components prepared by DIW process^[27-28]

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图 4 DIW工艺中陶瓷墨水组分设计及其相关作用机制

Figure 4. Component design and related mechanism of ceramic ink in DIW process

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图 5 分散剂对打印性能的影响：(a) 不同聚合物分子量的流变性能；(b) 不同聚合物分子量的维型能力^[34]

Figure 5. Effect of dispersants on printing performance: (a) rheological properties of different polymer molecular weights; (b) dimensional ability of different polymermolecular weights^[34]

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图 6 粘合剂对打印性能的影响：(a) 墨水形态；(b) 流变性能；(c) 核壳结构；(d) F-D理论曲线^[22,35-36]

Figure 6. The effect of adhesive on printing performance: (a) ink morphology; (b) rheological properties; (c) core shell structure;(d) F-D theoretical curve ^[22,35-36]

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图 7 陶瓷先驱体墨水的DIW打印成型：(a) 打印工艺流程；(b) 打印结构的厚度变化；(c) PCS先驱体墨水黏度和剪切速率；(d) BPCS先驱体墨水黏度与剪切速率^[27,40-41]

Figure 7. DIW printing molding of ceramic precursor ink: (a) printing process flow; (b) the thickness variation of the printing structure; (c) PCS precursor ink viscosity and shear rate; (d) viscosity and shear rate of BPCS precursor ink^[27,40-41]

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图 8 改性先驱体的DIW打印设备及工艺：(a) 紫外辅助打印设备；(b) 光敏效应墨水的打印成型；(c) 光热效应墨水的打印成型^[45-46]

Figure 8. DIW printing equipment and process for modified precursors: (a) UV assisted printing equipment; (b) printing and molding of photosensitive ink; (c) printing and forming of photothermal effect ink^[45-46]

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图 9 DIW工艺中短切纤维的加入方式：(a) 预先浸渍；(b) 共同挤出

Figure 9. The addition method of short cut fibers in the DIW process: (a) pre-impregnation; (b) co-extrusion

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图 10 短切纤维复合材料的DIW打印成型：(a) 短切纤维体积分数和长度范围；(b) 分散剂对纤维分布影响；(c) 构件的尺寸偏差比；(d) 核壳结构复合长丝共同挤出示意图^{[16,19,36,40,47-48]}

Figure 10. DIW printing forming of short cut fiber composite materials: (a) volume fraction and length range of short cut fibers; (b) the effect of dispersants on fiber distribution; (c) the dimensional deviation ratio of components; (d) schematic diagram of co-extrusion of core-shell structure composite filament^{[16,19,36,40,47-48]}

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图 11 DIW工艺中连续纤维的加入方式：(a) 连续纤维的表面上浆过程；(b) 斜插式喷嘴设计；(c) 折角式喷嘴设计；(d) 无折角喷嘴设计；(e) 超声辅助设计

Figure 11. Addition method of continuous fibers in DIW process: (a) surface sizing process of continuous fibers; (b) design of oblique insertion nozzle; (c) design of angled nozzles; (d) non angled nozzle design; (e) ultrasound assisted design

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图 12 连续纤维复合材料的DIW打印成型：(a) 多核打印系统示意图；(b) 多核墨水的流速分布；(c) 螺杆旋转输运连续纤维；(d) 超声辅助纤维分离技术^[20,35,51]

Figure 12. DIW printing molding of continuous fiber composite: (a) schematic diagram of multi-core printing system; (b) flow rate distribution of multi-core ink; (c) continuous fiber of screw rotation; (d) ultrasonic assisted fiber separation technology^[20,35,51]

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图 13 用于DIW打印技术的后致密化工艺流程

Figure 13. Post-compaction process flow for DIW printing technology

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图 14 DIW和PIP工艺的结合：(a) 典型工艺路线；(b) PIP致密化周期；(c) PIP致密化后的微结构^[53-54]

Figure 14. Combination of DIW and PIP processes: (a) typical process route; (b) pip densification cycle; (c) microstructure after PIP densification^[53-54]

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图 15 DIW和CVI工艺的结合：(a) 工艺流程；(b) CVI致密化周期与拉伸强度；(c) CVI工艺制备纤维涂层；(d) 纤维表面涂层显微结构^[47,55]

Figure 15. Combination of DIW and CVI process: (a) process flow; (b) CVI compaction cycle and tensile strength; (c) preparation of fiber coating by CVI process; (d) microstructure of fiber surface coating^[47,55]

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图 16 DIW和RMI工艺的结合：(a) C_sf/ZrB₂-SiC复合材料制备工艺示意图；(b) 致密化后的微观组织形貌^[49]

Figure 16. Combination of DIW and RMI processes:(a) schematic diagram of C_sf/ZrB₂-SiC composite preparation process; (b) microscopic tissue morphology after densification^[49]

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图 17 纤维强韧化机制：(a) 短切纤维核壳结构；(b) 高取向短切纤维裂纹扩展示意图；(c) 连续纤维核壳结构；(d) 连续纤维裂纹扩展示意图^{[20,36,47,52]}

Figure 17. Fiber strong toughness mechanism: (a) short cut fiber core shell structure; (b) schematic diagram of high orientation short cut fiber crack expansion; (c) continuous fiber core shell structure; (d) schematic diagram of continuous fiber crack expansion^{[20,36,47,52]}

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表 1 DIW制造陶瓷/陶瓷复材研究中的构件性能

Table 1. The mechanical properties of ceramic composite materials manufacturing using the DIW technique

Ceramic phase	Enhanced phase	Slurry design	Fiber extrusion method	Densification process	Fracture toughness/ (MPa·m^½)	Bending strength/MPa	Tensile strength/MPa	Ref.
SiC		Ceramic powder		Sintering		27.3		[27]
SiC	Continuous carbon fiber	Ceramic powder	Angle deviation	Sintering		219		[35]
SiC	Short carbon fiber	Ceramic powder	Co-extrusion 17.5 vol%	PIP	2.71	123		[36]
PMSSQ	Short carbon fiber	Ceramic precursor	Pre-impregnation 33 vol%	Pyrolysis				[40]
Al₂O₃		Modified precursor		Sintering		156.6		[45]
SiC	Short carbon fiber	Ceramic powder	Pre-impregnation 17.5 vol%	CVI、LSI	5.82	274		[47]
SiC	Short carbon fiber	Ceramic powder	Pre-impregnation 20 vol%	LSI、Carbonization		253.63	53.68	[48]
SiC	Continuous carbon fiber	Ceramic powder	No angle deviation	PIP	3.77	146		[51]
ZrB₂ SiC	Continuous carbon fiber	Ceramic powder	No angle deviation	Low temperature hot pressing	10.04	388.3		[20]
SiC	Continuous carbon fiber	Ceramic powder	Angle deviation	Sintering		232		[50]
PCS		Ceramic precursor		PIP、CVI			129.7	[53]
PCS	Short silicon carbide fiber	Ceramic precursor	Pre-impregnation 10 vol%	Pyrolysis		102.2		[19]
ZrB₂	Short carbon fiber	Ceramic powder	Fiber prefabricated components 1 wt%	CVI、SI、RMI				[49]
Notes: PMSSQ is Polymethylsilsesquioxane; PCS is Polycarbosilane; PIP is Precursor infiltration pyrolysis process; CVI is Chemical vapor infiltration process; LSI is Liquid silicon infiltration process; SI is Slurry impregnation process; RMI is Reactive melt infiltration process.

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