界面反应产物对B4C/Al复合材料颗粒润湿性及界面强度的影响机制

Effect of interfacial reaction products on the wettability and interfacial strength of B4C/Al composites

  • 摘要: 采用搅拌铸造法制备了B4C/Al复合材料,利用实验分析结合第一性原理计算的方法,探讨了界面反应产物Al3BC和TiB2对B4C/Al复合材料颗粒润湿性及界面结合强度的影响机制。结果表明,界面反应产物为Al3BC时,B4C颗粒润湿性没有得到实质性改善,存在明显的颗粒团聚现象,界面结合强度较低且过度的界面反应使B4C颗粒分解损耗严重,导致B4C颗粒增强效果不明显;而通过添加Ti元素使界面反应产物为TiB2时,颗粒润湿性明显改善,B4C颗粒团聚现象显著减少,界面结合强度较高,力学性能得到显著提高。这主要是由于不同终端的Al(111)/TiB2(0001)界面黏附功均大于Al(111)/B4C(0001)的界面黏附功,表明界面反应产物TiB2可以提高B4C颗粒的润湿性,而界面反应产物Al3BC对提高B4C颗粒的润湿性非常有限;Al(111)/Al3BC(0001)和Al(111)/TiB2(0001)的界面上均形成了混合的共价键/金属键;Al(111)/TiB2(0001)的界面上的化学键作用力更大,相应地界面结合强度也更大。

     

    Abstract: The B4C/Al composites were prepared by stirring casting method. The method of experimental analysis combined with first-principles calculations was used to explore the influence mechanism of the interfacial reaction products Al3BC and TiB2 on the wettability of B4C/Al composite particles and the interfacial bonding strength. The results show that when the interface reaction product is Al3BC, the wettability of B4C particles has not been substantially improved, particle agglomeration still exists, and the interface bonding is poor. Excessive interface reaction makes the decomposition and loss of B4C particles serious, resulting in insignificant strengthening effect of B4C particles. When the interface reaction product is TiB2 by adding Ti element, the particle wettability is significantly improved, the agglomeration of B4C particles is significantly reduced, the interface bonding strength is higher, and the mechanical properties are significantly improved. The Al(111)/TiB2(0001) interface adhesion work of different terminals is greater than that of Al(111)/B4C(0001), indicating that the interface reaction product TiB2 can improve the wettability of B4C particles. The interface reaction product Al3BC is very limited in improving the wettability of B4C particles. A mixed covalent/metallic bond is formed on the interface of Al(111)/Al3BC(0001) and Al(111)/TiB2(0001). The chemical bonding strength on the Al(111)/TiB2(0001) interface is greater, and the interface bonding strength is correspondingly greater.

     

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