酚醛树脂的改性及其对聚氨酯/金属粘接性能的影响

易玉华; 赵欣苗

酚醛树脂的改性及其对聚氨酯/金属粘接性能的影响

易玉华^,,
赵欣苗

华南理工大学　机械与汽车工程学院, 广州 510641

基金项目: 广州市科技计划项目(202102080477)

详细信息

通讯作者:
易玉华，硕士，高级工程师，硕士生导师，研究方向为橡塑改性及其复合材料　E-mail: mmyhyi@scut.edu.cn

中图分类号: TB332
计量
- 文章访问数: 90
- HTML全文浏览量: 58
- 被引次数: 0
出版历程
- 收稿日期: 2023-01-16
- 修回日期: 2023-02-09
- 录用日期: 2023-02-10
- 网络出版日期: 2023-03-02

Modification of phenolic resin and its effect on adhesive properties of polyurethane/metal

Yuhua YI^,,
Xinmiao ZHAO

School of Mechanical & Automotive Engineering, South China University of Technology, Guangzhou 510641, China

Funds: Science and Technology Program of Guangzhou (202102080477)

摘要

摘要: Chemlok218是聚氨酯(PU)/金属复合结构材料的常用粘接剂，为了获得较好的粘接强度，Chemlok218涂层表面温度通常需要在90℃以上，这在实际工业生产中很难实现，影响了其使用的便捷性。为了探究Chemlok218在较低温度下应用的可能性，使用高活性的PU改性剂，对Chenmlok218中的主要成分酚醛树脂(PF)进行改性，制备出与PU相容性更好、表面能更高的PF@NCO层，作为Chemlok218与PU的过渡层。PF@NCO中的高活性异氰酸酯基团(NCO)，一部分与Chemlok218中酚醛树脂的羟基发生反应，生成氨基甲酸酯基团，与Chemlok218之间形成牢固的粘接界面；另一部分与PU中的亚氨基反应，形成极性较高的脲基，通过化学键的方式，保障了与面胶PU间的牢固结合。Chemlock218与PU改性剂与的质量比为80:20时，PF@NCO-20的剥离强度可达23.4 kN/m^-1，较Chemlok218提高了58.1%，并且试样剥离平稳，无粘接薄弱点或缺陷，为解决室温下的PU/金属的粘接问题提供借鉴。1PU/金属粘接机制示意图2不同PU改性剂含量的PU/金属剥离界面图片
- 改性 /
- 酚醛树脂 /
- 聚氨酯 /
- 金属粘接 /
- 粘接性能 /
- Chemlok218
Abstract: To solve the problem of poor bonding effect of polyurethane (PU)/metal at room temperature when Chemlok218 was used as adhesive, a highly active PU modifier was used to modify phenolic resin (PF) in Chemlok218 to form a PF@NCO transition layer between Chemlok218 coating and PU. FTIR and TG analysis showed that the NCO group in PU modifier reacted with the hydroxyl group of PF to form carbamate group, and the surface energy of PF@NCO could be improved. The compatibility with PU had increased. When the mass ratio of Chemlok218 to PU modifier is 80∶20, the peel strength of PF@NCO-20 reaches 23.4 kN·m⁻¹, which is 58.1% higher than that of pure Chemlok218, and the whole PU/metal bonding sample had no bonding weaknesses and defects. The purpose of this paper is to provide a reference for solving the problem of bonding strength of PU/metal at room temperature.
- Modification /
- Phenolic Resin /
- Polyurethane /
- Metal Bonding /
- Bonding Property /
- Chemlok218

HTML全文

图 1 聚氨酯(PU)/钢材粘接样条的制备示意图

Figure 1. Schematic diagram of the preparation of polyurethane (PU)/steel bonded specimens

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图 2 Chemlok218、Chemlok218-A及酚醛树脂(PF)@NCO的红外光谱图

Figure 2. FTIR diagrams of Chemlok218, Chemlok218-A and phenolic resin (PF)@NCO samples

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图 3 TDI与酚羟基的反应式

Figure 3. Reaction Formula of TDI with Phenolic hydroxyl groups

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图 4 TDI与MOCA生成脲基的反应式

Figure 4. Reaction Formula for the formation of Urea Group between TDI and MOCA

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图 5 Chemlok218和Chemlok218-A的TG和DTG曲线

Figure 5. TG and DTG curves of Chemlok218 and Chemlok218-A

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图 6 (a)、(c): Chemlok218与PU预聚体的接触角；(b)、(d)PF@NCO与PU预聚体的接触角

Figure 6. (a), (c): Contact angle of Chemlok218 with PU prepolymer; (b), (d): contact angle of PF@NCO with PU prepolymer

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图 7 不同PU改性剂含量的PF@NCO剥离分析图：(a)剥离曲线(b)剥离强度柱状图

Figure 7. Peeling analysis diagrams of different PU modifier content PF@NCO T-shaped peeling curve：(a) peeling curves; (b) peel strength bar chart

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图 8 不同PU改性剂含量的PU/金属剥离界面图片

Figure 8. Peeling interface pictures of PU/metal with different PU modifier content

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图 9 PU/金属粘接机制示意图

Figure 9. Schematic diagram of PU/metal bonding mechanism

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表 1 Chemlok218和PF@NCO的接触角与表面能

Table 1. Contact angle and surface energy of Chemlok218 and PF@NCO

Sample	Contact Angle θ/(°)		Surface Free Energy/ (mJ·m⁻²)
Sample	Water	Ethylene Glycol	γd S	γp S	γ S
Chemlock218	70.1(1.2)	60.7(1.1)	5.1	12.9	18.0
PF@NCO	73.7(0.9)	55.0(1.4)	13.9	20.2	34.1
Notes: γ S, γd S and γp S are surface energy, non-polar part of surface energy and polar part of surface energy respectively. The data in parentheses refers to the standard deviation.

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